IP Library › Assignment 056780/0358
Patent Assignment
Reel/Frame 056780/0358

Assignment of Assignor's Interest

Recorded: 2021-07-07 Pages: 3
Assignors
ZHAO, LEI
Executed: 2021-07-02
REN, JIAXIANG
Executed: 2021-07-06
Assignee
CNPC USA CORPORATION
2901 WILCREST DR., HOUSTON, TEXAS, 77042
Covered Property (1)
Novel Bi-Continuous Epoxy Microstructure for Fabrication of Degradable Thermoset Composite Used in Hthp Downhole Conditions
Application: 17/369,571 →
Publication: US 2023/0022703
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 4, 2023
From: LIU, HUAILIANG; CHENG, PENG
To: CNPC USA CORP.
Reel/Frame 063216/0134 →
Assignment of Assignor's Interest Apr 4, 2023
From: CNPC USA CORP.
To: CNPC USA CORP.; BEIJING HUAMEI INC.; CHINA NATIONAL PETROLEUM CORPORATION
Reel/Frame 063216/0524 →