IP Library › Assignment 063216/0134
Patent Assignment
Reel/Frame 063216/0134

Assignment of Assignor's Interest

Recorded: 2023-04-04 Pages: 3
Assignors
LIU, HUAILIANG
Executed: 2022-07-11
CHENG, PENG
Executed: 2022-07-11
Assignee
CNPC USA CORP.
2901 WILCREST DRIVE, SUITE 600, HOUSTON, TEXAS, 77042
Covered Property (1)
Novel Bi-Continuous Epoxy Microstructure for Fabrication of Degradable Thermoset Composite Used in Hthp Downhole Conditions
Application: 17/369,571 →
Publication: US 2023/0022703
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2021
From: ZHAO, LEI; REN, JIAXIANG
To: CNPC USA CORPORATION
Reel/Frame 056780/0358 →
Assignment of Assignor's Interest Apr 4, 2023
From: CNPC USA CORP.
To: CNPC USA CORP.; BEIJING HUAMEI INC.; CHINA NATIONAL PETROLEUM CORPORATION
Reel/Frame 063216/0524 →