IP Library › Assignment 063216/0524
Patent Assignment
Reel/Frame 063216/0524

Assignment of Assignor's Interest

Recorded: 2023-04-04 Pages: 4
Assignor
CNPC USA CORP.
Executed: 2023-03-31
Assignees
CNPC USA CORP.
2901 WILCREST DRIVE, SUITE 600, HOUSTON, TEXAS, 77042
BEIJING HUAMEI INC.
NO. 23 TAIYANGGONG SOUTH ST., CHAO YANG DISTRICT, BEIJING, 102200, CHINA
CHINA NATIONAL PETROLEUM CORPORATION
9 DONGZHIMEN NORTH STREET, DONGCHENG DISTRICT, BEIJING, 100007, CHINA
Covered Property (1)
Novel Bi-Continuous Epoxy Microstructure for Fabrication of Degradable Thermoset Composite Used in Hthp Downhole Conditions
Application: 17/369,571 →
Publication: US 2023/0022703
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2021
From: ZHAO, LEI; REN, JIAXIANG
To: CNPC USA CORPORATION
Reel/Frame 056780/0358 →
Assignment of Assignor's Interest Apr 4, 2023
From: LIU, HUAILIANG; CHENG, PENG
To: CNPC USA CORP.
Reel/Frame 063216/0134 →