Patent Assignment
Reel/Frame 059184/0858
Assignment of Assignor's Interest
Recorded: 2022-03-07
Pages: 5
Assignors
CHIU, CHIN-TIEN
Executed: 2022-03-04
LI, JIA
Executed: 2022-03-03
XUE, DONGPENG
Executed: 2022-02-28
ZHANG, HUIRONG
Executed: 2022-02-28
ZHONG, GUOCHENG
Executed: 2022-02-28
WANG, XIAOHUI
Executed: 2022-02-28
TAN, HUA
Executed: 2022-03-01
Assignee
WESTERN DIGITAL TECHNOLOGIES, INC.
5601 GREAT OAKS PARKWAY, SAN JOSE, CALIFORNIA, 95119
Covered Property
(1)
Semiconductor Wafer and Semiconductor Dies Formed Therefrom Including Grooves Along Long Edges of the Semiconductor Dies
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Assignment of Assignor's Interest
May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name
Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →