Patent Assignment
Reel/Frame 060853/0459
Assignment of Assignor's Interest
Recorded: 2022-08-22
Pages: 8
Assignors
EJIRI, YOSHINORI
Executed: 2021-10-25
NAKAKO, HIDEO
Executed: 2021-10-25
KAWANA, YUKI
Executed: 2021-10-29
YONEKURA, MOTOKI
Executed: 2021-10-27
SUKATA, SHINICHIROU
Executed: 2021-10-25
ISHII, MANABU
Executed: 2021-10-27
FUJITA, MASARU
Executed: 2021-10-27
NATORI, MICHIKO
Executed: 2021-10-25
KIMURA, MASAHIRO
Executed: 2021-10-27
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Producing Substrate Having Through-Silicon Vias, Substrate Having Through-Silicon Vias, and Copper Paste for Through-Silicon via Formation
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Change of Address
Jun 5, 2025
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 071520/0177 →