Patent Assignment
Reel/Frame 071520/0177
Change of Address
Recorded: 2025-06-05
Pages: 11
Assignor
RESONAC CORPORATION
Executed: 2023-10-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Method for Producing Substrate Having Through-Silicon Vias, Substrate Having Through-Silicon Vias, and Copper Paste for Through-Silicon via Formation
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2022
From: EJIRI, YOSHINORI; NAKAKO, HIDEO; KAWANA, YUKI; YONEKURA, MOTOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 060853/0459 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →