Patent Assignment
Reel/Frame 061604/0025
SECURITY INTEREST
Recorded: 2022-10-04
Received: 2022-10-04
Pages: 11
Assignor
ROCKLEY PHOTONICS LIMITED
Executed: 2022-09-30
Assignee
WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
500 DELAWARE AVENUE, 11TH FLOOR, WSFS BANK CENTER, WILMINGTON, DE, 19801, UNITED STATES
Covered Applications
(38)
OPTICAL SENSOR MODULE
App. No. 17/934,502
→
HEALTH STATE ESTIMATION USING MACHINE LEARNING
App. No. 17/823,505
→
OPTICAL SPECKLE RECEIVER
App. No. 17/822,419
→
TRANSFER DIE FOR MICRO-TRANSFER PRINTING WITH NON-CONDUCTIVE ISOLATION LAYER AND ISOLATION TRENCH
App. No. 17/904,583
→
METHODS AND APPARATUSES FOR CALIBRATING A SENSOR
App. No. 17/886,409
→
WAVEGUIDE PLATFORM
App. No. 17/798,821
→
PHOTONIC MODULE AND METHOD OF MANUFACTURE
App. No. 17/798,525
→
SYSTEM AND METHOD FOR POSITIONING A SENSOR ON A SUBJECT
App. No. 17/817,321
→
PHOTODIODE FOR WEARABLE DEVICES
App. No. 17/816,900
→
PHOTONIC INTEGRATED CIRCUIT
App. No. 17/814,787
→
DEMULTIPLEXER
App. No. 17/793,914
→
SEMICONDUCTOR PHOTODIODE
App. No. 17/862,338
→
SOURCE WAFER AND METHOD OF PREPARATION THEREOF
App. No. 17/791,524
→
METHOD FOR III-V/SILICON HYBRID INTEGRATION
App. No. 17/858,021
→
METHOD FOR III-V/SILICON HYBRID INTEGRATION
App. No. 17/856,864
→
SENSING SYSTEM
App. No. 17/850,881
→
OPTOELECTRONIC DEVICE
App. No. 17/848,328
→
PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER
App. No. 17/757,823
→
THERMOSONIC BONDING FOR SECURING PHOTONIC COMPONENTS
App. No. 17/839,405
→
OPTICAL SENSING MODULE
App. No. 17/806,254
→
OPTICAL SENSING MODULE
App. No. 17/757,130
→
FREQUENCY SHIFTER FOR HETERODYNE INTERFEROMETRY MEASUREMENTS AND DEVICE FOR HETERODYNE INTERFEROMETRY MEASUREMENTS HAVING SUCH A FREQUENCY SHIFTER
App. No. 17/757,048
→
OPTICAL DEVICE FOR HETERODYNE INTERFEROMETRY
App. No. 17/757,037
→
OPTICAL INSTRUMENT AND METHOD FOR DETERMINING A WAVELENGTH OF LIGHT GENERATED BY A LIGHT SOURCE, AND OPTICAL SYSTEM COMPRISING THE OPTICAL INSTRUMENT
App. No. 17/832,509
→
GROWTH DEFECT REDUCTION AT GRATING TRANSITION
App. No. 17/756,808
→
LASER WITH WAVELENGTH-SELECTIVE REFLECTOR
App. No. 17/829,030
→
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF
App. No. 17/748,639
→
OPTICAL OUT-COUPLER UNIT FOR OUT-COUPLING LIGHT FROM A WAVEGUIDE
App. No. 17/744,108
→
OPTICAL INSTRUMENT AND METHOD FOR DETERMINING A WAVELENGTH OF LIGHT GENERATED BY A LIGHT SOURCE, AND OPTICAL SYSTEM COMPRISING THE OPTICAL INSTRUMENT
App. No. 17/743,427
→
OPTICAL MULTIPLEXER
App. No. 17/755,969
→
BONDING FIXTURE
App. No. 17/742,095
→
INTEGRATION OF PHOTONIC COMPONENTS ON SOI PLATFORM
App. No. 17/738,945
→
PHASE SHIFT KEYING MODULATOR
App. No. 17/734,962
→
METHOD OF PREPARING A DEVICE COUPON FOR MICRO-TRANSFER PRINTING, DEVICE WAFER INCLUDING SAID DEVICE COUPON, AND OPTOELECTRONIC DEVICE MANUFACTURED FROM SAID DEVICE WAFER
App. No. 17/733,947
→
OPTOELECTRONIC MODULE PACKAGE
App. No. 17/732,471
→
PHASE SHIFT KEYING MODULATOR
App. No. 17/711,965
→
OPTICAL MODULATOR AND METHOD OF USE
App. No. 17/712,036
→
OPTICAL SENSOR MODULE FOR SPECKLEPLETHYSMOGRAPHY (SPG) AND PHOTOPLETHYSMOGRAPHY (PPG)
App. No. 17/711,974
→