Patent Assignment
Reel/Frame 063287/0812
RELEASE OF SECURITY INTEREST - REEL/FRAME 061604/0025
Recorded: 2023-03-19
Received: 2023-03-19
Pages: 67
Assignor
WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Executed: 2023-03-14
Assignee
ROCKLEY PHOTONICS LIMITED
1 ASHLEY ROAD, 3RD FLOOR, ALTRINCHAM, CHESHIRE, GBX, WA142DT, UNITED KINGDOM
Covered Applications
(38)
OPTICAL SENSOR MODULE
App. No. 17/934,502
→
HEALTH STATE ESTIMATION USING MACHINE LEARNING
App. No. 17/823,505
→
OPTICAL SPECKLE RECEIVER
App. No. 17/822,419
→
TRANSFER DIE FOR MICRO-TRANSFER PRINTING WITH NON-CONDUCTIVE ISOLATION LAYER AND ISOLATION TRENCH
App. No. 17/904,583
→
METHODS AND APPARATUSES FOR CALIBRATING A SENSOR
App. No. 17/886,409
→
WAVEGUIDE PLATFORM
App. No. 17/798,821
→
PHOTONIC MODULE AND METHOD OF MANUFACTURE
App. No. 17/798,525
→
SYSTEM AND METHOD FOR POSITIONING A SENSOR ON A SUBJECT
App. No. 17/817,321
→
PHOTODIODE FOR WEARABLE DEVICES
App. No. 17/816,900
→
PHOTONIC INTEGRATED CIRCUIT
App. No. 17/814,787
→
DEMULTIPLEXER
App. No. 17/793,914
→
SEMICONDUCTOR PHOTODIODE
App. No. 17/862,338
→
SOURCE WAFER AND METHOD OF PREPARATION THEREOF
App. No. 17/791,524
→
METHOD FOR III-V/SILICON HYBRID INTEGRATION
App. No. 17/858,021
→
METHOD FOR III-V/SILICON HYBRID INTEGRATION
App. No. 17/856,864
→
SENSING SYSTEM
App. No. 17/850,881
→
OPTOELECTRONIC DEVICE
App. No. 17/848,328
→
PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER
App. No. 17/757,823
→
THERMOSONIC BONDING FOR SECURING PHOTONIC COMPONENTS
App. No. 17/839,405
→
OPTICAL SENSING MODULE
App. No. 17/806,254
→
OPTICAL SENSING MODULE
App. No. 17/757,130
→
OPTICAL DEVICE FOR HETERODYNE INTERFEROMETRY
App. No. 17/757,037
→
FREQUENCY SHIFTER FOR HETERODYNE INTERFEROMETRY MEASUREMENTS AND DEVICE FOR HETERODYNE INTERFEROMETRY MEASUREMENTS HAVING SUCH A FREQUENCY SHIFTER
App. No. 17/757,048
→
OPTICAL INSTRUMENT AND METHOD FOR DETERMINING A WAVELENGTH OF LIGHT GENERATED BY A LIGHT SOURCE, AND OPTICAL SYSTEM COMPRISING THE OPTICAL INSTRUMENT
App. No. 17/832,509
→
GROWTH DEFECT REDUCTION AT GRATING TRANSITION
App. No. 17/756,808
→
LASER WITH WAVELENGTH-SELECTIVE REFLECTOR
App. No. 17/829,030
→
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF
App. No. 17/748,639
→
OPTICAL OUT-COUPLER UNIT FOR OUT-COUPLING LIGHT FROM A WAVEGUIDE
App. No. 17/744,108
→
OPTICAL MULTIPLEXER
App. No. 17/755,969
→
OPTICAL INSTRUMENT AND METHOD FOR DETERMINING A WAVELENGTH OF LIGHT GENERATED BY A LIGHT SOURCE, AND OPTICAL SYSTEM COMPRISING THE OPTICAL INSTRUMENT
App. No. 17/743,427
→
BONDING FIXTURE
App. No. 17/742,095
→
INTEGRATION OF PHOTONIC COMPONENTS ON SOI PLATFORM
App. No. 17/738,945
→
PHASE SHIFT KEYING MODULATOR
App. No. 17/734,962
→
METHOD OF PREPARING A DEVICE COUPON FOR MICRO-TRANSFER PRINTING, DEVICE WAFER INCLUDING SAID DEVICE COUPON, AND OPTOELECTRONIC DEVICE MANUFACTURED FROM SAID DEVICE WAFER
App. No. 17/733,947
→
OPTOELECTRONIC MODULE PACKAGE
App. No. 17/732,471
→
OPTICAL SENSOR MODULE FOR SPECKLEPLETHYSMOGRAPHY (SPG) AND PHOTOPLETHYSMOGRAPHY (PPG)
App. No. 17/711,974
→
PHASE SHIFT KEYING MODULATOR
App. No. 17/711,965
→
OPTICAL MODULATOR AND METHOD OF USE
App. No. 17/712,036
→