Patent Assignment
Reel/Frame 065464/0500
Assignment of Assignor's Interest
Recorded: 2023-11-06
Pages: 4
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2006-07-20
RUSLI, SUKIANTO
Executed: 2006-07-20
HINER, DAVID JON
Executed: 2006-07-28
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties
(3)
Buildup Dielectric Layer Having Metallization Pattern Semiconductor Package Fabrication Method
Patent:
8,341,835 →
Application:
12/387,691 →
Buildup Dielectric Layer Having Metallization Pattern Semiconductor Package Fabrication Method
Patent:
9,691,635 →
Application:
13/679,627 →
Methods of Manufacturing an Encapsulated Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →
Assignment of Assignor's Interest
Feb 18, 2021
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 055322/0266 →