IP Library Assignment 065755/0627
Patent Assignment
Reel/Frame 065755/0627

Confirmatory License

Recorded: 2023-12-04 Pages: 5
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-05-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVENUE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties (3)
Methods of Forming High Aspect Ratio Openings and Methods of Forming High Aspect Ratio Features
Application: 15/858,021 →
Publication: US 2019/0206723
Methods of Forming High Aspect Ratio Openings and Methods of Forming High Aspect Ratio Features
Application: 17/155,770 →
Publication: US 2021/0143055
Methods of Forming High Aspect Ratio Features
Application: 17/811,285 →
Publication: US 2022/0344200
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2017
From: TOKASHIKI, KEN; SMYTHE, JOHN A.; SANDHU, GURTEJ S.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 044995/0449 →
Supplement No. 7 to Patent Security Agreement Feb 6, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 045267/0833 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050716/0678 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →