Patent Assignment
Reel/Frame 066051/0672
Assignment of Assignor's Interest
Recorded: 2024-01-08
Pages: 3
Assignors
SCANLAN, CHRISTOPHER MARC
Executed: 2005-12-05
HUEMOELLER, RONALD PATRICK
Executed: 2005-12-02
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(2)
Semiconductor Package Including a Top-Surface Metal Layer for Implementing Circuit Features
Patent:
8,018,068 →
Application:
12/589,839 →
Semiconductor Package Including a Top-Surface Metal Layer for Implementing Circuit Features
Patent:
8,227,338 →
Application:
13/136,457 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Dec 6, 2012
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 029422/0178 →
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →