Patent Assignment
Reel/Frame 066060/0703
Assignment of Assignor's Interest
Recorded: 2024-01-09
Pages: 3
Assignor
GLENN, THOMAS P.
Executed: 1998-06-23
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(6)
Method of Making an Integrated Circuit Package
Method of Making an Integrated Circuit Package
Patent:
6,893,900 →
Application:
10/688,710 →
Method of Making an Integrated Circuit Package
Patent:
7,005,326 →
Application:
10/847,742 →
Method of Making an Integrated Circuit Package
Patent:
7,112,474 →
Application:
11/299,859 →
Method of Making an Integrated Circuit Package
Patent:
7,332,375 →
Application:
11/503,752 →
Integrated Circuit Package and Method of Making the Same
Patent:
8,853,836 →
Application:
13/662,702 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →