IP Library › Assignment 066704/0219
Patent Assignment
Reel/Frame 066704/0219

Assignment of Assignor's Interest

Recorded: 2024-03-08 Pages: 3
Assignors
KANG, YANG BEOM
Executed: 2019-08-27
SHIN, KANG SUP
Executed: 2019-08-26
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Properties (3)
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Application: 17/097,224 →
Publication: US 2021/0066134
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Application: 17/741,791 →
Publication: US 2022/0270932
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Application: 18/111,079 →
Publication: US 2023/0207394
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 10, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 066710/0590 →
Change of Name Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →