Patent Assignment
Reel/Frame 066710/0590
Assignment of Assignor's Interest
Recorded: 2024-03-10
Pages: 13
Assignor
MAGNACHIP SEMICONDUCTOR, LTD.
Executed: 2020-08-28
Assignee
KEY FOUNDRY CO., LTD.
215 DAESIN-RO (HYANGJEONG-DONG), HEUNGDEOK-GU, CHUNGBUK, CHEONGJU-SI, KOREA, REPUBLIC OF
Covered Properties
(17)
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Single Poly Non-Volatile Memory Device, Method of Manufacturing the Same and Single Poly Non-Volatile Memory Device Array
Semiconductor Device Having a Diode Type Electrical Fuse (E-Fuse) Cell Array
Semiconductor and Method of Fabricating the Same
High Voltage Semiconductor Device and Manufacturing Method of High Voltage Semiconductor Device
Semiconductor Device Including Nonvolatile Memory Device and Logic Device and Manufacturing Method of Semiconductor Device Including Nonvolatile Memory Device and Logic Device
Semiconductor Device with Controllable Channel Length and Manufacturing Method Thereof
Semiconductor Device Having a Diode Type Electrical Fuse (E-Fuse) Cell Array
Nonvolatile Memory Device
Semiconductor Device with Controllable Channel Length and Manufacturing Method of Semiconductor Device with Controllable Channel Length
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Manufacturing Method of Semiconductor Device Using Gate-Through Implantation
High Voltage Semiconductor Device and Manufacturing Method of High Voltage Semiconductor Device
Semiconductor Device Having Deep Trench Structure and Method of Manufacturing Thereof
Semiconductor Device Including Nonvolatile Memory Device and Logic Device and Manufacturing Method of Semiconductor Device Including Nonvolatile Memory Device and Logic Device
Semiconductor Device with Controllable Channel Length and Manufacturing Method Thereof
High Voltage Semiconductor Device and Manufacturing Method of High Voltage Semiconductor Device
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 23, 2024
From: CHO, MIN KUCK; LEE, SEUNG HOON
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066547/0650 →
Assignment of Assignor's Interest
Feb 23, 2024
From: SHIN, HYUN KWANG; LEE, JUNG HWAN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066547/0740 →
Assignment of Assignor's Interest
Feb 23, 2024
From: JI, HEE HWAN; KIM, JI MAN; HONG, SONG HWA; OH, BO SEOK
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066547/0858 →
Assignment of Assignor's Interest
Mar 8, 2024
From: KIM, YOUNG BAE; KIM, KWANG IL
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066701/0891 →
Assignment of Assignor's Interest
Mar 8, 2024
From: KIM, SU JIN; YOO, HYE JIN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066703/0956 →
Assignment of Assignor's Interest
Mar 8, 2024
From: KANG, YANG BEOM; SHIN, KANG SUP
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066704/0219 →
Assignment of Assignor's Interest
Mar 8, 2024
From: SHIN, HYUN KWANG
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066704/0244 →
Assignment of Assignor's Interest
Mar 8, 2024
From: KIM, KWANG IL; KANG, YANG BEOM; LEE, JUNG HWAN; CHO, MIN KUCK
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066704/0344 →
Assignment of Assignor's Interest
Mar 8, 2024
From: CHUNG, JIN SEONG; LEE, TAE HOON
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066704/0418 →
Assignment of Assignor's Interest
Mar 8, 2024
From: CHO, JONG MIN; PARK, SUNG BUM; AHN, KEE SIK; PARK, SEONG JUN
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 066704/0468 →
Change of Name
Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →