Patent Assignment
Reel/Frame 071549/0900
Corrective Assignment to Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded on Reel 38378 Frame 427. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2025-06-13
Pages: 7
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties
(3)
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP
Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar
Semiconductor Device and Method of Forming Leadframe with Conductive Bodies for Vertical Electrical Interconnect of Semiconductor Die
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 30, 2011
From: PARK, DONGSAM; LEE, YONGDUK
To: STATS CHIPPAC, LTD.
Reel/Frame 026205/0874 →
Assignment of Assignor's Interest
Apr 30, 2011
From: CHOI, DAESIK; PARK, SANG MI
To: STATS CHIPPAC, LTD.
Reel/Frame 026205/0902 →
Assignment of Assignor's Interest
May 12, 2011
From: CHOI, DAESIK; PARK, SOOSAN; SHIN, HANGIL
To: STATS CHIPPAC, LTD.
Reel/Frame 026270/0251 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →