Patent Assignment
Reel/Frame 072369/0041
Change of Name
Recorded: 2025-08-08
Pages: 7
Assignor
HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Executed: 2025-06-25
Assignee
SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.
ROOM 608, BUILDING 1, NO.6 LIANHUI STREET, XIXING SUB-DISTRICT, BINJIANG DISTRICT, ZHEJIANG PROVINCE, HANGZHOU, 310051, CHINA
Covered Properties
(12)
A Plit-Gate Mosfet Having a First Trench with Tapper Sidewalls Formed on a Second Trench with Vertical Sidewalls
Application:
17/986,977 →
Publication:
US 2023/0207684
Split-Gate Mosfet and Manufacturing Method Thereof
Application:
18/089,726 →
Publication:
US 2023/0207685
Trench-Type Mosfet and Method for Manufacturing the Same
Manufacturing Method of Trench-Type Power Device
Application:
18/091,559 →
Publication:
US 2023/0215931
Trench-Type Power Device and Manufacturing Method Thereof
Super-Junction Device
Method for Manufacturing Conducting Path in Doped Region, Trench-Type Mosfet Device and Manufacturing Method Thereof
Application:
17/944,284 →
Publication:
US 2023/0077336
Super-Junction Device and Manufacturing Method Thereof
Application:
17/946,100 →
Publication:
US 2023/0093383
Split-Gate Power Mos Device and Manufacturing Method Thereof
Method for Manufacturing Trench-Gate Mosfet
Application:
17/951,543 →
Publication:
US 2023/0100307
Method for Manufacturing Trench-Type Mosfet
Application:
18/299,245 →
Publication:
US 2023/0335621
Silicon Carbide Mosfet Device and Manufacturing Method Thereof
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 6, 2021
From: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.
To: HANGZHOU CHUANGQIN SENSOR TECHNOLOGY CO., LTD.
Reel/Frame 058304/0530 →
Assignment of Assignor's Interest
Dec 6, 2021
From: HANGZHOU CHUANGQIN SENSOR TECHNOLOGY CO., LTD.
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 058304/0586 →
Assignment of Assignor's Interest
Dec 6, 2021
From: WU, BING; WANG, JIAKUN
To: SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.
Reel/Frame 058304/0460 →
Assignment of Assignor's Interest
Aug 5, 2022
From: CHEN, HUI
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061099/0473 →
Assignment of Assignor's Interest
Aug 15, 2022
From: WANG, JIAKUN; WU, BING
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061174/0902 →
Assignment of Assignor's Interest
Sep 14, 2022
From: LIU, JIAN; CAI, JINYONG
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061088/0352 →
Assignment of Assignor's Interest
Sep 16, 2022
From: WANG, JIAKUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061114/0880 →
Assignment of Assignor's Interest
Sep 23, 2022
From: HE, SUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061535/0347 →
Corrective Assignment to Correct the Inventor's Name Previously Recorded at Reel: 061535 Frame: 0347. Assignor(S) Hereby Confirms the Assignment .
Oct 27, 2022
From: SUN, HE
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061785/0741 →
Assignment of Assignor's Interest
Nov 15, 2022
From: CAI, JINYONG; DONG, SHIDA; WANG, JIAKUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061768/0256 →
Assignment of Assignor's Interest
Dec 28, 2022
From: CAI, JINYONG; DONG, SHIDA; WANG, JIAKUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 062221/0856 →
Assignment of Assignor's Interest
Dec 30, 2022
From: YANG, XIAO; CHEN, HUI; WANG, JIAKUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 062243/0731 →
Assignment of Assignor's Interest
Dec 30, 2022
From: YANG, XIAO; CHEN, HUI; WANG, JIAKUN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 062253/0873 →
Assignment of Assignor's Interest
Mar 1, 2023
From: WANG, JIAKUN; LI, LVQIANG; CHEN, HUI
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 062837/0713 →
Assignment of Assignor's Interest
Apr 12, 2023
From: WANG, JIAKUN; YAO, ZHAOMING
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 063307/0753 →
Corrective Assignment to Correct the 2ND Inventor's Name on the Assignment Document Previously Recorded on Reel 062837 Frame 0713. Assignor(S) Hereby Confirms the Assignment.
Apr 19, 2023
From: WANG, JIAKUN; LI, LVQIANG; CHEN, HUI
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 063740/0881 →