Patent Assignment
Reel/Frame 072476/0454
Change of Name
Recorded: 2025-08-19
Pages: 3
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Method of Forming Protective Material Between Semiconductor Die Stacked on Semiconductor Wafer to Reduce Defects During Singulation
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 2009
From: LIM, TAEGKI; YUN, JAEUN; LEE, SUNGYOON
To: STATS CHIPPAC, LTD.
Reel/Frame 023514/0246 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →
Assignment of Assignor's Interest
Dec 4, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 073833/0156 →