IP Library Assignment 074049/0988
Patent Assignment
Reel/Frame 074049/0988

Notice of Grant of Security Interest in Intellectual Property

Recorded: 2025-12-23 Pages: 7
Assignor
WOLFSPEED, INC.
Executed: 2025-12-23
Assignee
U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
333 COMMERCE STREET, SUITE 900, NASHVILLE, TENNESSEE, 37201
Covered Properties (16)
Process for Producing Silicon Carbide Crystals Having Increased Minority Carrier Lifetimes
Patent: 7,811,943 →
Application: 11/052,679 →
Publication: US 2006/0130742
Three Inch Silicon Carbide Wafer with Low Warp, Bow, and Ttv
Patent: 7,422,634 →
Application: 11/101,110 →
Publication: US 2006/0225645
Low Basal Plane Dislocation Bulk Grown Sic Wafers
Patent: 7,294,324 →
Application: 11/147,645 →
Publication: US 2006/0075958
Methods of Processing Semiconductor Wafers Having Silicon Carbide Power Devices Thereon
Patent: 7,547,578 →
Application: 11/531,975 →
Publication: US 2007/0066039
Reduction of Carrot Defects in Silicon Carbide Epitaxy
Patent: 9,903,046 →
Application: 11/745,817 →
Publication: US 2008/0054412
Micropipe-Free Silicon Carbide and Related Method of Manufacture
Patent: 9,099,377 →
Application: 11/854,864 →
Publication: US 2008/0083366
Micropipe-Free Silicon Carbide and Related Method of Manufacture
Patent: 8,410,488 →
Application: 11/854,878 →
Publication: US 2008/0067524
Low Micropipe 100 mm Silicon Carbide Wafer
Patent: 8,618,552 →
Application: 11/940,423 →
Publication: US 2008/0237609
Low 1C Screw Dislocation 3 Inch Silicon Carbide Wafer
Patent: 8,384,090 →
Application: 11/940,454 →
Publication: US 2008/0169476
Double Guard Ring Edge Termination for Silicon Carbide Devices
Patent: 9,640,609 →
Application: 12/037,211 →
Publication: US 2009/0212301
Methods of Processing Semiconductor Wafers Having Silicon Carbide Power Devices Thereon
Patent: 9,349,596 →
Application: 12/474,720 →
Publication: US 2009/0233418
Junction Termination Structures Including Guard Ring Extensions and Methods of Fabricating Electronic Devices Incorporating Same
Patent: 8,803,277 →
Application: 13/024,812 →
Publication: US 2012/0205666
Field Effect Transistor Devices with Low Source Resistance
Patent: 9,029,945 →
Application: 13/102,510 →
Publication: US 2012/0280252
Field Effect Transistor Devices with Low Source Resistance
Patent: 9,142,662 →
Application: 13/108,440 →
Publication: US 2012/0280270
Localized Annealing of Metal-Silicon Carbide Ohmic Contacts and Devices So Formed
Patent: 9,608,166 →
Application: 13/417,913 →
Publication: US 2012/0164765
Junction Termination Structures Including Guard Ring Extensions and Methods of Fabricating Electronic Devices Incorporating Same
Patent: 9,385,182 →
Application: 14/325,558 →
Publication: US 2014/0319646
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Jun 30, 2023
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 064185/0755 →
Release of Security Interest in Intellectual Property Collateral at Reel/Frame No. 64185/0755 Sep 30, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 072989/0001 →
Notice of Grant of Security Interest in Intellectual Property Dec 23, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 074050/0001 →
Notice of Grant of Security Interest in Intellectual Property Dec 23, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 074050/0026 →
Notice of Grant of Security Interest in Intellectual Property Dec 23, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 074050/0033 →