Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio
View Patent ↗A semiconductor device has a substrate including a base substrate material and a plurality of conductive vias formed partially though the substrate. A plurality of semiconductor die including a base semiconductor material is disposed over the substrate. A ratio of an encapsulant to a quantity of the semiconductor die is determined for providing structural support for the semiconductor die. An encapsulant is deposited over the semiconductor die and substrate. An amount of the encapsulant is selected based on the determined ratio or based on a total amount of the base substrate material and base semiconductor material. Channels are formed in the encapsulant by removing a portion of the encapsulant in a peripheral region of the semiconductor die. Alternatively, a side surface of the semiconductor die is partially exposed with respect to the encapsulant. A portion of the base substrate material is removed to expose the conductive vias.
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a plurality of semiconductor die over the substrate;
determining a ratio of an encapsulant to a quantity of the semiconductor die for providing structural support for the semiconductor die;
depositing the encapsulant over the semiconductor die and substrate, wherein an amount of the encapsulant is selected according to the determined ratio; and
removing a portion of the substrate.
2. The method of claim 1 , further including removing a portion of the encapsulant in a peripheral region of the semiconductor die.
3. The method of claim 2 , wherein removing the portion of the encapsulant further includes forming channels in the encapsulant.
4. The method of claim 3 , further including singulating through the channels to remove the channels.
5. The method of claim 1 , further including forming a plurality of conductive vias partially through a first surface of the substrate.
6. The method of claim 5 , wherein removing the portion of the substrate further includes removing the portion of the substrate from a second surface of the substrate opposite the first surface to expose the conductive vias.
7. A method of making a semiconductor device, comprising:
providing a substrate including a base substrate material;
disposing a semiconductor die including a base semiconductor material over the substrate;
depositing an encapsulant around the semiconductor die, wherein an amount of the encapsulant is selected based on a total amount of the base substrate material and base semiconductor material; and
removing a portion of the substrate.
8. The method of claim 7 , further including depositing the encapsulant while leaving a portion of a side surface of the semiconductor die exposed with respect to the encapsulant.
9. The method of claim 7 , further including removing a portion of the encapsulant to expose a side surface of the semiconductor die.
10. The method of claim 7 , further including removing a portion of the encapsulant to form a channel in the encapsulant in a peripheral region of the semiconductor die.
11. The method of claim 10 , further including singulating through the channel to remove the channel.
12. The method of claim 7 , further including:
depositing the encapsulant over the semiconductor die; and
removing a portion of the encapsulant from over a surface of the semiconductor die.
13. The method of claim 7 , further including:
forming a plurality of conductive vias partially through a first surface of the substrate; and
removing the portion of the substrate to expose the conductive vias.
14. A method of making a semiconductor device, comprising:
providing a substrate including a base substrate material;
disposing a semiconductor die including a base semiconductor material over the substrate;
depositing an encapsulant over the semiconductor die; and
removing a portion of the encapsulant to reduce a volume of encapsulant based on a total amount of the base substrate material and base semiconductor material.
15. The method of claim 14 , further including forming a channel in the encapsulant outside a footprint of the semiconductor die.
16. The method of claim 15 , further including singulating through the channel to remove the channel.
17. The method of claim 15 , further including forming the channel by patterning, wet etching, sand blasting, sawing, or laser cutting.
18. The method of claim 14 , further including removing a portion of the substrate after removing the portion of the encapsulant.
19. The method of claim 14 , further including forming an interconnect structure over a surface of the substrate opposite the semiconductor die.
20. A method of making a semiconductor device, comprising:
providing a substrate including a base substrate material;
disposing a semiconductor die including a base semiconductor material over the substrate; and
depositing an encapsulant around the semiconductor die, wherein an amount of the encapsulant is selected based on a total amount of the base substrate material and base semiconductor material.
21. The method of claim 20 , further including removing a portion of the encapsulant in a peripheral region of the semiconductor die.
22. The method of claim 21 , wherein removing the portion of the encapsulant further includes forming a channel in the encapsulant.
23. The method of claim 22 , further including forming the channel by patterning, wet etching, sand blasting, sawing, or laser cutting.
24. The method of claim 22 , further including singulating through the channel to remove the channel.
25. The method of claim 22 , further including removing a portion of the substrate after forming the channel.