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App. No. 09/794,999 · Confirmation No. 4157

PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (CVD) METHOD TO FILL A TRENCH IN A SEMICONDUCTOR SUBSTRATE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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 Code Description Pages PDF
2001-02-28 TRNA Transmittal of New Application 3 View
2001-02-28 SPEC Specification 6 View
2001-02-28 CLM Claims 2 View
2001-02-28 ABST Abstract 1 View
2001-02-28 DRW Drawings-only black and white line drawings 3 View
2001-02-28 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/794,999
Filed
2001-02-28
Granted
2002-03-26
Examiner
DANG, PHUC T
Art Unit
2818
PTA
0 days