IP Library Assignment 023785/0396
Patent Assignment
Reel/Frame 023785/0396

Assignment of Assignor's Interest

Recorded: 2010-01-14 Pages: 386
Assignors
INFINEON TECHNOLOGIES AG
Executed: 2006-04-25
SEMICONDUCTOR 300 GMBH & CO. KG
Executed: 2006-04-25
Assignee
QIMONDA AG
GUSTAV-HEINEMANN-RING 212, MUNICH, 81739, GERMANY
Covered Properties (12)
Polishing Head for Wafer, and Method for Polishing
Patent: 6,375,549 →
Application: 09/527,859 →
Wafer Container Having Electrically Conductive Kinematic Coupling Groove to Detect the Presence of the Wafer Container on a Support Surface, the Support Surface, and Method
Patent: 6,389,707 →
Application: 09/641,153 →
Conveying Element and Conveyor Means for Conveying Wafer Receptacles, and Method
Patent: 6,732,855 →
Application: 09/658,152 →
Method for Determining an Endpoint and Semiconductor Wafer
Patent: 6,593,238 →
Application: 09/723,151 →
Assembly Comprising a Plurality of Mask Containers, Manufacturing System for Manufacturing Semiconductor Devices, and Method
Patent: 6,895,294 →
Application: 09/729,636 →
Publication: US 2003/0074097
Plasma-Enhanced Chemical Vapor Deposition (Cvd) Method to Fill a Trench in a Semiconductor Substrate
Patent: 6,362,098 →
Application: 09/794,999 →
Method for Providing Semiconductor Device and Corresponding Semiconductor Device
Patent: 6,486,049 →
Application: 09/845,600 →
Publication: US 2002/0158340
Apparatus and Method for Measuring the Degradation of a Tool
Patent: 6,633,379 →
Application: 09/877,531 →
Publication: US 2002/0186370
Wafer Scribing Method and Wafer Scribing Device
Patent: 6,914,006 →
Application: 10/016,633 →
Publication: US 2003/0109141
Wafer handling device and method for testing wafers
Application: 10/016,638 →
Publication: US 2003/0082031
Apparatus for and Method of Wafer Grinding
Patent: 6,752,694 →
Application: 10/290,907 →
Publication: US 2004/0092209
Method and system for operating a semiconductor factory
Application: 10/327,191 →
Publication: US 2004/0118659
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
Assignment and Assumption of Security Interest in Patents Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
Assignment and Assumption of Security Interest in Patents Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
Confirmatory Patent Assignment Mar 24, 2016
From: INFINEON TECHNOLOGIES AG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038238/0934 →
Release of Security Interest Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
Release of Security Interest Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
Merger Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name. Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Corrective Assignment to Correct the Remove Patents 8108266 and 8062324 and Replace Them with 6108266 and 8060324 Previously Recorded on Reel 037518 Frame 0292. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents. Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
Corrective Assignment to Correct the to Correct the Application No. from 13,883,290 to 13,833,290 Previously Recorded on Reel 041703 Frame 0536. Assignor(S) Hereby Confirms the the Assignment and Assumption of Security Interest in Patents.. Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 037486 Frame 0517. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents. Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 040928 Frame 0001. Assignor(S) Hereby Confirms the Release of Security Interest. Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
Corrective Assignment to Correct the Remove Application 11759915 and Replace It with Application 11759935 Previously Recorded on Reel 040925 Frame 0001. Assignor(S) Hereby Confirms the Release of Security Interest. Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →