IP Library Granted Patent US 6,752,694
Granted Patent Utility
US 6,752,694 · Confirmation No. 3431

APPARATUS FOR AND METHOD OF WAFER GRINDING

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Code Description Pages PDF
2004-04-16 IFEE Issue Fee Payment (PTO-85B) 2 View
2004-02-20 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2004-02-20 FOR Foreign Reference 52 View
2002-11-08 TRNA Transmittal of New Application 2 View
2002-11-08 SPEC Specification 17 View
2002-11-08 CLM Claims 4 View
2002-11-08 ABST Abstract 1 View
2002-11-08 DRW Drawings-only black and white line drawings 2 View
2002-11-08 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,752,694
App. No.
10/290,907
Filed
2002-11-08
Granted
2004-06-22
Pub. No.
US20040092209A1
Art Unit
3723
PTA
0 days