Patent Assignment
Reel/Frame 011618/0384
Assignment of Assignor's Interest
Recorded: 2001-02-28
Pages: 7
Assignors
BREEDEN, TERRY ALAN
Executed: 2001-01-26
SHAHVANDI, IRAJ ERIC
Executed: 2001-01-26
TUCKER, MICHAEL THOMAS
Executed: 2001-01-18
VATEL, OLIVIER GERARD MARC
Executed: 2001-01-26
MAUTZ, KARL EMERSON
Executed: 2001-01-26
ZEDLITZ, RALF
Executed: 2001-01-12
Assignees
MOTOROLA, INC.
INTELLECTUAL PROPERTY DEPT., 1303 EAST ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196
SEMICONDUCTOR 300 GMBH & CO. KG
INTELLECTUAL PROPERTY DEPT., MANFRED-V.-ARDENNE-RING 20, BUILDING 20, 01099 DRESDEN, GERMANY
INFINEON TECHNOLOGIES AG
INTELLECTUAL PROPERTY DEPT., SANKT-MARTIN-STR. 53, 81541 MUNCHEN, GERMANY
Covered Property
(1)
Plasma-Enhanced Chemical Vapor Deposition (Cvd) Method to Fill a Trench in a Semiconductor Substrate
Patent:
6,362,098 →
Application:
09/794,999 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2004
From: MOTOROLA, INC.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015698/0657 →
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES AG; SEMICONDUCTOR 300 GMBH & CO. KG
To: QIMONDA AG
Reel/Frame 023785/0396 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →