IP Library Granted Patent US 6,596,625
Granted Patent Utility
US 6,596,625 · Confirmation No. 8071

METHOD AND DEVICE FOR PRODUCING A METAL/METAL CONTACT IN A MULTILAYER METALLIZATION OF AN INTEGRATED CIRCUIT

⬇ PDF
Code Description Pages PDF
2001-08-20 TRNA Transmittal of New Application 1 View
2001-08-20 SPEC Specification 22 View
2001-08-20 CLM Claims 3 View
2001-08-20 ABST Abstract 1 View
2001-08-20 DRW Drawings-only black and white line drawings 11 View
2001-08-20 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,596,625
App. No.
09/932,899
Filed
2001-08-20
Granted
2003-07-22
Pub. No.
US20020022342A1
Examiner
VU, DAVID
Art Unit
2818
PTA
-3 days