Granted Patent
Utility
US 6,531,378
· Confirmation No. 6801
METHOD FOR PROCESSING WAFER BY APPLYING LAYER TO PROTECT THE BACKSIDE DURING A TEMPERING STEP AND REMOVING CONTAMINATED PORTIONS OF THE LAYER
Inventor:
Joachim Hopfner
|
⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-10-01 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-10-01 | SPEC |
Specification | 16 | View | |
| 2001-10-01 | CLM |
Claims | 3 | View | |
| 2001-10-01 | ABST |
Abstract | 1 | View | |
| 2001-10-01 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2001-10-01 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Joachim Hopfner
Planegg, GERMANY
Attorneys & Agents of Record
Classification
USPC
438/473
H10D1/682
H10P95/00
H10B12/033
H10P95/90
Prosecution
- Examiner
- SMOOT, STEPHEN W
- Art Unit
- 2813
- Docket No.
- L&L-I0180
- Confirmation No.
- 6801
Foreign Priority
199 15 078.8
·
1999-04-01
·
GERMANY
Publication
- Pub. No.
- US20020086532A1
- Pub. Date
- 2002-07-04
Patent Term Adjustment
-151days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2015-08-19
from
HOEPFNER, JOACHIM
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-12-16
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Quick Facts
- Patent No.
- US 6,531,378
- App. No.
- 09/968,576
- Filed
- 2001-10-01
- Granted
- 2003-03-11
- Pub. No.
- US20020086532A1
- Examiner
- SMOOT, STEPHEN W
- Art Unit
- 2813
- PTA
- -151 days
External Links