Patent Assignment
Reel/Frame 013586/0952
Assignment of Assignor's Interest
Recorded: 2002-12-16
Pages: 2
Assignor
HOEPFNER, JOACHIM
Executed: 2001-10-16
Assignee
INFINEON TECHNOLOGIES AG
RIDLERSTRASSE 55, PATENTABTEILUNG, MUENCHEN, 80339, GERMANY
Covered Property
(1)
Method for Processing Wafer by Applying Layer to Protect the Backside During a Tempering Step and Removing Contaminated Portions of the Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0001 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Aug 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036396/0646 →