IP Library Granted Patent US 6,630,201
Granted Patent Utility
US 6,630,201 · Confirmation No. 6918

ADSORPTION PROCESS FOR ATOMIC LAYER DEPOSITION

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Code Description Pages PDF
2009-01-12 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2008-11-20 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-06-27 A.NE Response After Final Action 1 View
2003-06-27 ABST Abstract 2 View
2003-06-27 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2003-06-27 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-06-27 LET. Miscellaneous Incoming Letter 1 View
2003-06-27 DRW Drawings-only black and white line drawings 40 View
2001-10-24 TRNA Transmittal of New Application 1 View
2001-10-24 SPEC Specification 51 View
2001-10-24 CLM Claims 1 View
2001-10-24 ABST Abstract 1 View
2001-10-24 DRW Drawings-only black and white line drawings 40 View
2001-10-24 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,630,201
App. No.
09/999,636
Filed
2001-10-24
Granted
2003-10-07
Pub. No.
US20020146511A1
Art Unit
1762
PTA
-53 days