Patent Assignment
Reel/Frame 014788/0211
Assignment of Assignor's Interest
Recorded: 2004-06-28
Received: 2004-06-28
Pages: 2
Assignor
ANGSTRON SYSTEMS, INC.
Executed: 2004-05-17
Assignee
NOVELLUS SYSTEMS, INC.
4000 NORTH FIRST STREET, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(8)
Sequential Method for Depositing a Film by Modulated Ion-Induced Atomic Layer Deposition (Mii-Ald)
Application:
10/137,851 →
Varying Conductance Out of a Process Region to Control Gas Flux in an Ald Reactor
Application:
10/027,592 →
Adsorption Process for Atomic Layer Deposition
Application:
09/999,636 →
Substrate temperature control in an ALD reactor
Application:
10/000,825 →
Variable Gas Conductance Control for a Process Chamber
Application:
09/902,080 →
Method and Apparatus for Improved Temperature Control in Atomic Layer Deposition
Application:
09/854,092 →
Sequential Method for Depositing a Film by Modulated Ion-Induced Atomic Layer Deposition (Mii-Ald)
Application:
09/812,285 →
Continuous Method for Depositing a Film by Modulated Ion-Induced Atomic Layer Deposition (Mii-Ald)
Application:
09/812,486 →