IP Library Granted Patent US 6,569,501
Granted Patent Utility
US 6,569,501 · Confirmation No. 1815

SEQUENTIAL METHOD FOR DEPOSITING A FILM BY MODULATED ION-INDUCED ATOMIC LAYER DEPOSITION (MII-ALD)

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Code Description Pages PDF
2009-01-12 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2008-11-20 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2002-05-03 TRNA Transmittal of New Application 2 View
2002-05-03 SPEC Specification 30 View
2002-05-03 CLM Claims 10 View
2002-05-03 ABST Abstract 1 View
2002-05-03 DRW Drawings-only black and white line drawings 11 View
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Quick Facts
Patent No.
US 6,569,501
App. No.
10/137,851
Filed
2002-05-03
Granted
2003-05-27
Pub. No.
US20020164421A1
Art Unit
1762
PTA
0 days