IP Library Granted Patent US 6,614,091
Granted Patent Utility
US 6,614,091 · Confirmation No. 9175

SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR

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Code Description Pages PDF
2003-06-27 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-06-27 LET. Miscellaneous Incoming Letter 1 View
2002-03-13 TRNA Transmittal of New Application 2 View
2002-03-13 SPEC Specification 8 View
2002-03-13 CLM Claims 3 View
2002-03-13 ABST Abstract 1 View
2002-03-13 DRW Drawings-only black and white line drawings 2 View
2002-03-13 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,614,091
App. No.
10/097,059
Filed
2002-03-13
Granted
2003-09-02
Pub. No.
US20030173637A1
Examiner
LE, THAO P
Art Unit
2818
PTA
0 days