Dynamic use of process temperature
View Patent ↗A process for reacting a gaseous species with a substrate includes placing the substrate in a space, heating the space, introducing the gaseous species into the space, and cooling the space. Introducing the gaseous species into the space includes introducing the gaseous species into the space before the substrate reaches a steady state temperature and/or reacting the gaseous species with the substrate includes reacting the gaseous species with the substrate while cooling the space.
1. In a process for reacting a first gaseous species with a substrate, the process including placing the substrate in a space, heating the space to a first temperature to create a temperature bias in the substrate, introducing the first gaseous species into the space, and cooling the space from the first temperature according to a temperature profile, the temperature profile being designed to compensate for the effect of the temperature bias created during the heating step, the process further including both introducing the first gaseous species into the space before the substrate reaches the first temperature and reacting the first gaseous species with the substrate while cooling the space.
2. The process of claim 1 wherein introducing the first gaseous species into the space includes introducing oxygen into the space.
3. The process of claim 2 further including introducing a second gaseous species into the space to react with the first gaseous species in the space.
4. The process of claim 3 wherein introducing the first gaseous species into the space includes introducing oxygen into the space and introducing the second gaseous species into the space includes introducing hydrogen into the space.
5. The process of claim 1 wherein introducing the first gaseous species into the space includes introducing nitrogen into the space.
6. The process of claim 1 wherein heating the space to a first temperature includes commanding the temperature of the space to increase in a single step to the first temperature, cooling the space from the first temperature includes commanding the temperature of the space to decrease in a single step from the first temperature to a second temperature.
7. The process of claim 6 wherein cooling the space from the first temperature further includes commanding the temperature of the space to decrease in a single step from the second temperature to a third temperature.
8. The process of claim 7 wherein cooling the space from the first temperature further includes commanding the temperature of the space to decrease in a single step from the third temperature to a fourth temperature.
9. A process for reacting a first gaseous species with a substrate having a central region and an edge region, the process including placing the substrate in a space, heating the space to a first temperature to create a temperature bias between the central region and the edge region, introducing the first gaseous species into the space, and cooling the space from the first temperature according to a temperature profile, the temperature profile being designed to compensate for the effect of the temperature bias created during the heating step said process further including both introducing the first gaseous species into the space before the substrate reaches the first temperature and reacting the first gaseous species with the substrate while cooling the space.
10. The process of claim 9 wherein introducing the first gaseous species into the space includes introducing oxygen into the space.
11. The process of claim 10 further including introducing a second gaseous species into the space to react with the first gaseous species in the space.
12. The process of claim 9 wherein introducing the first gaseous species into the space includes introducing oxygen into the space and introducing the second gaseous species into the space includes introducing hydrogen into the space.
13. The process of claim 9 wherein introducing the first gaseous species into the space includes introducing nitrogen into the space.
14. The process of claim 9 wherein heating the space to a first temperature includes commanding the temperature of the space to increase in a single step to the first temperature, and cooling the space from the first temperature includes commanding the temperature of the space to decrease in a single step from the first temperature to a second temperature.
15. The process of claim 14 wherein cooling the space from the first temperature further includes commanding the temperature of the space to decrease in a single step from the second temperature to a third temperature.
16. The process of claim 15 wherein cooling the space from the first temperature further includes commanding the temperature of the space to decrease in a single step from the third temperature to a fourth temperature.