IP Library Granted Patent US 6,882,531
Granted Patent B2
US 6,882,531 · App. 10/201,230 · Granted Apr 19, 2005

Method and rack for exchanging air with modular bricks in a computer system

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Quick Facts
Patent No.
US 6,882,531
App. No.
10/201,230
Granted
Apr 19, 2005
Kind
B2
Abstract

A modular computing system that includes an enclosure and a rack at least partially mounted within the enclosure. The modular computing system further includes a plurality of modular bricks that each include electronic components. The modular bricks are mounted in the rack and connected to the conduits in the rack. A fan is also connected to the conduits in the rack such that the rack exchanges air between the fan and each modular brick to cool the electronic components in each of the modular bricks.

Claims (29)

1. A method for exchanging air with modular bricks in a computer system, comprising;

placing a modular brick into a rack inside an enclosure, the modular brick including electronic components; and

using the rack to exchange air with the modular brick to cool the electronic components in the modular brick.

2. The method according to claim 1 , wherein placing a modular brick into a rack includes securing a conduit on the rack to the modular brick.

3. The method according to claim 1 , wherein using the rack exchange air with the modular brick includes forcing air from the modular brick into the rack.

4. The method according to claim 1 , wherein using the rack exchange air with the modular brick includes forcing air from the rack into the modular brick.

5. The method according to claim 1 , wherein using the rack to exchange air with the modular brick includes connecting the rack to a primary fan.

6. The method according to claim 5 , wherein placing a modular brick into a rack includes at least partially placing the modular brick into an enclosure.

7. The method according to claim 6 , wherein connecting the rack to a primary fan includes connecting the rack to the primary fan inside the enclosure.

8. The method according to claim 5 , wherein using the rack to exchange air with the modular brick further includes connecting the rack to a secondary fan that exchanges air with the modular brick when there is a malfunction with the primary fan.

9. The method according to claim 5 , further comprising placing at least one additional modular brick that includes electronic components into the rack within the computer system; and wherein using the rack to exchange air with the modular brick includes using the rack to exchange air with each modular brick to cool the electronic components in each modular brick.

10. A modular computing system, comprising:

a modular brick that includes electronic components;

an enclosure; and

a rack inside the enclosure, the rack supporting the modular brick and exchanging air with the modular brick to cool the electronic components in the brick.

11. The modular computing system of claim 10 , further comprising at least one additional modular brick that includes electronic components, the rack exchanging air with each of the modular bricks to cool the electronic components in each brick.

12. The modular computing system of claim 11 , wherein each of the modular bricks are the same size.

13. The modular computing system of claim 11 , further comprising a primary fan connected to the rack, the fan forcing air exchange between the rack and the modular brick.

14. The modular computing system of claim 13 , wherein the primary fan forces air from the rack into the modular brick.

15. The modular computing system of claim 13 , wherein the primary fan forces air from the modular brick into the rack.

16. The modular computing system of claim 13 , further comprising a controller that detects when there is a malfunction in the primary fan.

17. The modular computing system of claim 16 , further comprising a backup fan connected to the rack such that the backup fan exchanges air with the modular brick to cool the electronic components in the modular brick when the controller detects a malfunction in the primary fan.

18. The modular computing system of claim 10 wherein the rack includes at least one conduit that is connected to the modular brick.

19. The modular computing system of claim 10 wherein the rack is partially mounted within the enclosure.

20. A modular computing system, comprising:

an enclosure;

a rack at least partially mounted within the enclosure, the rack including conduits;

a plurality of modular bricks mounted in the rack and connected to one or more of the conduits in the rack, each modular brick including electronic components; and

a fan connected to the conduits in the rack such that the rack exchanges air between the fan and each modular brick to cool the electronic components in each of the modular bricks.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2017
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 044128/0149 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 040545/0362 →
ORDER...AUTHORIZING THE SALE OF ALL OR SUBSTANTIALLY ALL OF THE ASSETS OF THE DEBTORS FREE AND CLEAR OF ALL LIENS, ENCUMBRANCES, AND INTERESTS. Recorded Jul 26, 2016
From: FOOTHILL CAPITAL CORPORATION
To: SILICON GRAPHICS, INC.
Reel/Frame 039474/0606 →
ORDER...AUTHORIZING THE SALE OF ALL OR SUBSTANTIALLY ALL OF THE ASSETS OF THE DEBTORS FREE AND CLEAR OF ALL LIENS, ENCUMBRANCES, AND INTERESTS. Recorded Jul 26, 2016
From: MORGAN STANLEY & CO., INCORPORATED
To: SILICON GRAPHICS, INC.
Reel/Frame 039482/0015 →
SECURITY INTEREST Recorded Mar 13, 2015
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035200/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2014
From: SILICON GRAPHICS, INC.
To: SILICON GRAPHICS INTERNATIONAL, INC.
Reel/Frame 032714/0032 →
CHANGE OF NAME Recorded Apr 18, 2014
From: SILICON GRAPHICS INTERNATIONAL, INC.
To: SGI INTERNATIONAL, INC.
Reel/Frame 032714/0230 →
MERGER Recorded Apr 18, 2014
From: SGI INTERNATIONAL, INC.
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 032714/0427 →