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App. No. 10/229,868 · Confirmation No. 2027

DEADHESION METHOD AND MECHANISM FOR WAFER PROCESSING

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-09-12 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-09-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2003-09-12 REM Applicant Arguments/Remarks Made in an Amendment 47 View
2003-09-12 DRW Drawings-only black and white line drawings 2 View
2003-09-12 LET. Miscellaneous Incoming Letter 2 View
2002-08-27 TRNA Transmittal of New Application 2 View
2002-08-27 SPEC Specification 36 View
2002-08-27 CLM Claims 38 View
2002-08-27 ABST Abstract 1 View
2002-08-27 DRW Drawings-only black and white line drawings 13 View
2002-08-27 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/229,868
Filed
2002-08-27
Granted
2004-02-17
Pub. No.
US20030008508A1
Art Unit
1765
PTA
-101 days