IP Library Granted Patent US 6,506,679
Granted Patent Utility
US 6,506,679 · Confirmation No. 6987

DEADHESION METHOD AND MECHANISM FOR WAFER PROCESSING

⬇ PDF
Code Description Pages PDF
2001-08-29 TRNA Transmittal of New Application 2 View
2001-08-29 SPEC Specification 35 View
2001-08-29 CLM Claims 38 View
2001-08-29 ABST Abstract 1 View
2001-08-29 DRW Drawings-only black and white line drawings 13 View
2001-08-29 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,506,679
App. No.
09/942,181
Filed
2001-08-29
Granted
2003-01-14
Pub. No.
US20020009825A1
Art Unit
1765
PTA
-95 days