IP Library › Granted Patent US 6,686,258
Granted Patent Utility
US 6,686,258 · Confirmation No. 4873

METHOD OF TRIMMING AND SINGULATING LEADED SEMICONDUCTOR PACKAGES

Inventor: Jae Hak Yee
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2016-04-07 OATH Oath or Declaration filed 9 View
2007-07-16 PA.. Power of Attorney 2 View
2007-07-16 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2007-07-16 C.AD Change of Address 1 View
2007-07-16 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-09-02 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-09-06 TRNA Transmittal of New Application 3 View
2002-09-06 ADS Application Data Sheet 2 View
2002-09-06 A.PE Preliminary Amendment 1 View
2002-09-06 SPEC Specification 13 View
2002-09-06 CLM Claims 4 View
2002-09-06 ABST Abstract 1 View
2002-09-06 DRW Drawings-only black and white line drawings 10 View
2002-09-06 OATH Oath or Declaration filed 2 View
2002-09-06 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,686,258
App. No.
10/236,650
Filed
2002-09-06
Granted
2004-02-03
Pub. No.
US20030011006A1
Examiner
LE, DUNG ANH
Art Unit
2818
PTA
0 days