IP Library › Granted Patent US 6,909,170
Granted Patent B2
US 6,909,170 · App. 10/291,153 · Granted Jun 21, 2005

Semiconductor assembly with package using cup-shaped lead-frame

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,909,170
App. No.
10/291,153
Granted
Jun 21, 2005
Kind
B2
Abstract

A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

Claims (12)

1. A semiconductor assembly comprising: a semiconductor package having a thickness of 0.7 mm or less, a semiconductor die (having an exposed surface) comprising a front side comprising an exposed surface in a first plane and a back side in a second plane wherein said front side of said semiconductor die a plurality of electrical contacts for electrically coupling to a support surface;

a lead frame cupped to define a recess and sized to accommodate said semiconductor die wherein an inner surface of said lead frame is electrically coupled to said back side of said semiconductor die; and

a plurality of leads extending from said lead frame and electrically coupled to said inner surface of said lead frame wherein each of said plurality of leads comprises a portion that is co-planar with said first plane of said back side of said semiconductor die.

2. The semiconductor assembly as recited in claim 1 further comprising a material covering a portion of an outer surface of said lead frame.

3. The semiconductor assembly as recited in claim 1 herein said semiconductor die comprises a MOSFET, wherein said back side of said semiconductor die comprises a contact to a drain of said MOSFET and wherein said plurality of electrical contacts on said front side of said semiconductor die comprise contacts to a source and gate of said MOSFET.

4. The semiconductor die as recited in claim 1 further comprising a layer of conductive cement between said semiconductor die and said lead frame.

5. The semiconductor assembly as recited in claim 4 wherein said conductive cement comprises conductive epoxy.

6. The semiconductor assembly as recited in claim 1 further comprising a plastic capsule coupled to an outside surface of said lead frame.

7. The semiconductor assembly as recited in claim 1 further comprising plastic material between an edge of said semiconductor die and said lead frame.

8. A semiconductor package comprising said package having a length of substantially 240 mils and a width of substantially 200 mils, a semiconductor die (having an exposed surface) comprising a front side having an exposed surface and a back side in a second plane;

a lead frame oriented in a plane and comprising a portion cupped out of said plane to form a recess sized to receive said semiconductor die wherein an inner surface of cupped portion of said lead frame is electrically coupled to said back side of said semiconductor die; and

a housing molded over and protecting said lead frame and said semiconductor die wherein said front side of said semiconductor die is exposed for coupling with a support surface.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →