Method of reducing pattern distortions during imprint lithography processes
View Patent ↗The present invention is directed to a method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having the pattern recorded therein, defining an original pattern. The method includes, defining a region on the layer in which to produce the recorded pattern. Relative extenuative variations between the substrate and the mold are created to ensure that the original pattern defines an area coextensive with the region. Thereafter, the recorded pattern is formed in the region. The relative extenuative variations are created by heating or cooling of the substrate so that the region defines an area that is slightly smaller/larger than the area of the original pattern. Then compression/tensile forces are applied to the mold to provide the recorded pattern with an area coextensive with the area of the region.
1. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
defining a region on said layer in which to produce said recorded pattern;
creating relative extenuative variations between said substrate and said mold by varying a temperature of one of said substrate and said mold so that an area defined by said original pattern differs from said area defined by said region; and
applying mechanical stresses to said mold to varying said area associated with said original pattern to be coextensive with said area defined by said region.
2. The method as recited in claim 1 wherein applying mechanical stress further includes applying compression forces to said mold.
3. The method as recited in claim 1 wherein applying mechanical stresses further includes applying tensile stresses to said mold.
4. The method as recited in claim 1 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said area defined by said region to be less than said area defined by said original pattern.
5. The method as recited in claim 1 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said area defined by said region to be greater than said area defined by said original pattern.
6. The method as recited in claim 1 wherein defining said region further includes defining a plurality of regions on said layer in which to produce said recorded pattern, sequentially placing said original pattern in superimposition with each region associated with a subgroup of said plurality of regions and creating relative extenuative variations between said mold and one of the regions of said subgroup in superimposition therewith by varying said temperature of one of said substrate and said mold so that the area defined by said one of the regions differs from an area defined by said original pattern and applying mechanical stresses further includes applying mechanical stresses to said mold to vary said area defined by said original pattern to be coextensive with said area defined by said one of the regions.
7. The method as recited in claim 1 further including depositing a bead of polymerizable material upon said substrate and spreading said bead over said substrate to define said layer, with forming said recorded pattern further including contacting said layer with said mold to create said recorded pattern in said region and subjecting said layer to conditions to polymerize said layer, wherein creating relative extenuative variations in said substrate and said mold occurs after contacting said layer with said mold.
8. The method as recited in claim 1 further including creating a flowable site on said substrate to define said layer, with forming said recorded pattern further including contacting said if lowable site with said mold to create said recorded pattern in said region and subjecting said layer to conditions to solidify said layer, wherein creating relative extenuative variations in said substrate and said mold occurs after contacting said if lowable region with said mold.
9. The method as recited in claim 1 further including forming a plurality of fiducials in said region and providing said mold with a plurality of alignment marks, wherein creating relative extenuative variations further includes superimposing said mold with said region and sensing differences in alignment between said if iducials and said alignments marks.
10. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
defining a plurality of regions on said layer in which to produce said recorded pattern by depositing a plurality of beads of polymerizable material upon said substrate, and spreading said plurality of beads over said substrate to define said layer by repeatably superimposing a mold, having a relief structure, with each of said plurality of regions and contacting said plurality of beads with said mold to create a recess and a protrusion;
forming a plurality of fiducials in each of said plurality of regions and providing said mold with a plurality of alignment marks;
creating relative extenuative variations between said substrate and said mold by varying a temperature of one of said substrate and said mold so that an area defined by said original pattern differs from an area defined by said one of said plurality of regions in superimposition therewith;
applying mechanical stresses to said mold to vary said area defined by said original pattern to be coextensive with said area defined by said one of said plurality of regions; and
sensing differences in alignment between said fiducials and said alignment marks.
11. The method as recited in claim 10 wherein applying mechanical stress further includes applying, to said mold, forces selected from a set of forces consisting essentially of compression forces and tensile forces.
12. The method as recited in claim 11 further including subjecting said layer to conditions to polymerize said polymerizable material.
13. The method as recited in claim 12 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said area defined by said region to be less than said area defined by said original pattern.
14. The method as recited in claim 13 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said area defined by said region to be greater than said area defined by said original pattern.
15. A method of reducing distortions in a pattern disposed on a layer of a substrate, defining a recorded pattern, employing a mold having features to form said pattern on said layer, defining an original pattern, said method comprising:
defining a region on said layer in which to produce said recorded pattern;
creating relative extenuative variations, in first and second transverse directions, between said substrate and said mold by varying a temperature of one of said substrate and said mold so a distance said original pattern extends along said first direction differs from a distance that said region extends along said first direction; and
applying mechanical stress to said mold to vary said distance said original pattern extends along said first direction to be coextensive with said distance said region extends along said first direction.
16. The method as recited in claim 15 wherein creating relative extenuative variations further includes varying said temperature of one of said substrate and said mold so a distance said original pattern extends along said second direction differs from a distance said region extends along said second direction and applying mechanical stress further includes varying said distance said original pattern extends along said second direction to be coextensive with said distance said region extends along said second direction.
17. The method as recited in claim 15 wherein applying mechanical stress further includes applying compression forces to said mold to vary said distance said original pattern extends along said first and second transverse directions.
18. The method as recited in claim 15 wherein applying mechanical stresses further includes applying tensile stresses to said mold to vary said distance said original pattern extends along said first and second transverse directions.
19. The method as recited in claim 15 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said distance along said first direction said region extends to be less than said distance along said first direction said original pattern extends.
20. The method as recited in claim 15 wherein creating extenuative variations further includes varying said temperature of said substrate to vary said distance along said first direction said region extends to be greater than said distance along said first direction said original pattern extends.