IP Library › Granted Patent US 6,892,443
Granted Patent B2
US 6,892,443 · App. 10/304,261 · Granted May 17, 2005

Method of manufacturing a resistor

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Quick Facts
Patent No.
US 6,892,443
App. No.
10/304,261
Granted
May 17, 2005
Kind
B2
Abstract

A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×10 6 psi to about 100×10 6 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.

Claims (6)

1. A method of manufacturing a resistor comprising:

providing a substrate having a modulus of elasticity of about 10×10 6 psi to about 100×10 6 psi and a thickness of about 0.5 mils to about 200 mils, the substrate selected to contribute to a cumulative effect of reduction of resistance change due to power;

providing a first resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils, the first resistive foil selected to contribute to a cumulative effect of reduction of resistance change due to power;

cementing the first resistive foil to a first surface of the substrate with a cement selected to contribute to a cumulative effect of reduction of resistance change due to power; and

cementing a second resistive foil having a low TCR of about 0.1 to about 1 ppm/° C and a thickness of about 0.03 mils to about 0.7 mils to a second surface of the substrate opposite the first surface, the first and second resistive foils patterned to have approximately equal resistance value.

2. The method of claim 1 further comprising interconnecting the first resistive foil and the second resistive foil to provide approximately equal power dissipation on the first and second surfaces thereby reducing temperature gradients across the substrate, preventing bending of the substrate, and avoiding resistance change due to bending.

Assignments (7)
SECURITY INTEREST Recorded Mar 20, 2020
From: VISHAY PRECISION FOIL, INC.
To: JPMORGAN CHASE BANK, NATIONAL ASSOCIATION
Reel/Frame 052181/0923 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
NUNC PRO TUNC ASSIGNMENT Recorded Jul 28, 2016
From: VISHAY INTERTECHNOLOGY, INC.
To: VISHAY PRECISION FOIL, INC.
Reel/Frame 039280/0663 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →