IP Library › Granted Patent US 6,967,390
Granted Patent B2
US 6,967,390 · App. 10/367,344 · Granted Nov 22, 2005

Electronic component and method of manufacturing same

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Quick Facts
Patent No.
US 6,967,390
App. No.
10/367,344
Granted
Nov 22, 2005
Kind
B2
Abstract

An electronic component includes an electronic chip ( 110 ) and a chip carrier portion ( 120 ) having sidewalls ( 121 ) and a bottom portion ( 122 ). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component.

Claims (63)

1. An electronic component comprising:

an electronic chip; and

a leadframe comprising a chip carrier portion having sidewalls and a bottom portion;

wherein:

the electronic chip is mounted over the bottom portion of the chip carrier portion; and

the chip carrier portion shields the electronic chip from radiation outside of the electronic component.

2. The electronic component of claim 1 wherein:

the electronic chip is an MRAM device.

3. The electronic component of claim 1 wherein:

the chip carrier portion is comprised of copper and a radiation-shielding material.

4. The electronic component of claim 3 further comprising:

a radiation-shielding layer located over the electronic chip.

5. The electronic component of claim 3 wherein:

the copper is a first layer of the chip carrier portion; and

the radiation-shielding material is a second layer of the chip carrier portion.

6. The electronic component of claim 3 wherein:

the radiation-shielding material is comprised of a ferromagnetic material.

7. The electronic component of claim 6 wherein:

the ferromagnetic material comprises nickel-iron.

8. The electronic component of claim 6 wherein:

the ferromagnetic material comprises nickel-iron-cobalt.

9. The electronic component of claim 3 wherein:

the chip carrier portion has a first surface and a second surface opposite the first surface; and

the electronic chip is mounted over the first surface of the chip carrier portion.

10. The electronic component of claim 9 wherein:

the radiation-shielding material is located adjacent to the first surface and the second surface of the chip carrier portion.

11. The electronic component of claim 1 wherein:

the sidewalls have a height substantially equal to a height of the electronic chip.

12. The electronic component of claim 1 wherein:

the sidewalls comprise a unitary piece.

13. The electronic component of claim 1 wherein:

the sidewalls are contiguous with the bottom portion.

14. The electronic component of claim 1 wherein:

the sidewalls and the bottom portion form a unitary piece.

15. The electronic component of claim 1 wherein:

the sidewalls and the bottom portion are each substantially planar; and

the sidewalls are substantially perpendicular to the bottom portion.

16. The electronic component of claim 1 wherein:

the sidewalls and the bottom portion form an angle between approximately eighty degrees and one hundred degrees.

17. An electronic component comprising:

an electronic chip;

a ferromagnetic radiation-shielding layer over the electronic chip; and

a leadframe comprising a chip carrier portion having a bottom portion and sidewalls,

wherein:

the sidewalls and the bottom portion from a unitary piece;

the sidewalls and the bottom portion each comprise:

a first layer comprised of copper; and

a second layer comprised of a ferromagnetic radiation-shielding material; and

the electronic chip is mounted over the chip carrier portion.

18. The electronic component of claim 17 wherein:

the ferromagnetic radiation-shielding material and the ferromagnetic radiation-shielding layer comprise nickel-iron.

19. The electronic component of claim 17 wherein:

the chip carrier portion has a first surface and a second surface opposite the first surface;

the electronic chip is mounted over the first surface of the chip carrier portion; and

the second surface of the chip carrier portion forms a portion of on exterior surface of the electronic component.

20. The electronic component of claim 19 wherein:

the ferromagnetic radiation-shielding material is located adjacent to the first surface and the second surface of the chip carrier portion.

21. The electronic component of claim 17 wherein:

the sidewalls arid the bottom portion are each substantially planar;

the sidewalls are substantially perpendicular to the bottom portion; and

the sidewalls and the bottom portion comprise a unitary piece.

22. The electronic component of claim 17 wherein:

the sidewalls and the bottom portion form an angle between approximately eighty degrees and one hundred degrees.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2018
From: NXP USA, INC.
To: VLSI TECHNOLOGY LLC
Reel/Frame 045084/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →