IP Library Granted Patent US 6,870,396
Granted Patent B2
US 6,870,396 · App. 10/429,004 · Granted Mar 22, 2005

Tileable field-programmable gate array architecture

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Quick Facts
Patent No.
US 6,870,396
App. No.
10/429,004
Granted
Mar 22, 2005
Kind
B2
Abstract

An apparatus includes a field-programmable gate array (FPGA). The FPGA includes a first FPGA tile, and the first FPGA tile includes a plurality of functional groups (FGs), a regular routing structure, and a plurality of interface groups (IGs). The plurality of FGs are arranged in rows and columns with each of the FGs being configured to receive regular input signals, perform a logic operation, and generate regular output signals. The regular routing structure is coupled to the FGs and configured to receive the regular output signals, route signals within the first FPGA tile, and provide the regular input signals to the FGs. The routability of the regular routing structure is maximized by depositing switches according to designators. This novel designation method provides the same routability with approximately half the switches. Thus, further reduction in routing area is achieved. The plurality of IGs surround the plurality of FGs such that one IG is positioned at each end of each row and column. Each of the IGs is coupled to the regular routing structure and configured to transfer signals from the regular routing structure to outside of the first FPGA tile.

Claims (24)

1. An interconnect structure in a field programmable gate array (FPGA) comprising:

a FPGA having a plurality of logic components arranged in a plurality of rows and columns and having input ports and output ports;

a plurality of sets of first row conductors coupled to a first row logic component and a set of second row conductors coupled to a second row logic component, each one in said sets of first row conductors and second row conductors having a different designator, and said first row logic component adjacent to said second row logic component;

a plurality of sets of first column conductors coupled to a first column logic component and a set of second column conductors coupled to a second column logic component, each one in said sets of first column conductor and second column conductors having a different designator, said first column logic component adjacent to said second column logic component;

a plurality of vertical routing conductors, each one in said sets of vertical conductors having a different designator, said sets of vertical routing conductors forming a first plurality of intersections with said sets of output conductors;

a plurality of sets of horizontal routing conductors, each one in said sets of horizontal routing conductors having a different designator, said sets of horizontal routing conductors forming a second plurality of intersections with said sets of input conductors and forming a third plurality of intersections between said sets of vertical routing conductors, said third intersection having four quadrants; and

programmable interconnect elements at selected intersections in said first, second and third pluralities of intersections.

2. The interconnect structure of claim 1 , wherein:

said programmable interconnect elements in said first plurality of intersections are only provided at intersections made by conductors having the same designators;

said programmable interconnect elements in said second plurality of intersections are only provided at intersections made by conductors having the same designators; and

sets of adjacent ones of said sets of horizontal and vertical routing conductors in diagonally opposed quadrants of said third plurality of intersections are identified as odd and even, said programmable interconnect elements in said third plurality are only provided at intersections of horizontal and vertical conductors having like designators in odd sets in odd rows and even sets in even rows.

3. An interconnect structure in a field programmable gate array (FPGA) comprising:

a set of routing conductors and interconnects between adjacent functional groups (FGs) comprising:

a plurality of left output conductors (LOT 0 -LOT 4 ) and a plurality of right output conductors (ROT 0 -ROT 4 );

a plurality of vertical conductors (VT 0 [ 0 : 4 ]-VT 11 [ 0 : 4 ]) that form intersections with said left output conductors and said right output conductors;

a plurality of horizontal conductors (HT 0 [ 0 : 4 -HT 11 0 : 4 ] that form intersections with said vertical conductors (VT 0 [ 0 : 4 ]-VT 11 [ 0 : 4 ]);

a plurality of bottom input conductors (EBI 1 -EBI 4 ] and a plurality of upper input conductors (EUI 1 -EUI 4 ) that form intersections with said horizontal conductors; and

programmable interconnect elements at selected ones of said intersections.

4. The interconnect structure according to claim 1 , wherein said set of routing conductors between FGs further comprises:

said programmable interconnect elements at said left output conductors and said vertical conductors, wherein for each set of vertical conductors 0-11, the programmable interconnect elements are provided at LOT 0 VT 0 0 , LOT 1 VT 0 1 , LOT 2 VT 2, , LOT 3 VT 3 and LOT 4 VT 4 ;

said programmable interconnect elements at said right output conductors and said vertical conductors, wherein for each set of vertical conductors 0-11, the programmable interconnect elements are provided at ROT 0 VT 0 0 , ROT 1 VT 0 1 , ROT 2 VT 2, , ROT 3 VT 3 and ROT 4 VT 4 ;

said programmable interconnect elements at said vertical conductors and said horizontal conductors, wherein for each set of vertical conductors 1-11 and each set of horizontal conductors 1-11 intersecting at VT 0 HTO, VT 0 HT 2 , VT 0 HT 4 , VTIHT 0 , VT 1 HT 3 , VT 1 HT 5 , VT 2 HT 0 , VT 2 HT 2 , VT 2 HT 4 , VT 3 HT 1 , VT 3 HT 3 , VT 3 HT 5 , VT 4 HTO, VT 4 HT 2 , VT 0 HT 4 , VT 5 HT 1 , VT 5 HT 3 , VT 5 HT 5 , VT 6 HT 6 , VT 6 HT 8 , VT 6 HT 10 , VT 7 HT 7 , VT 7 HT 9 , VT 7 HT 11 , VT 8 HT 6 , VT 8 HT 8 , VT 8 HT 10 , VT 9 HT 7 , VT 9 HT 9 , VT 9 HT 11 , VT 10 HT 6 , VT 10 HT 8 , VT 10 HT 10 , VT 11 HT 7 , VT 11 HT 9 , VT 11 HT 11 , the programmable interconnect elements are provided at HT 0 VT 0 0 ,HT 1 VT 0 1 ,HT 2 VT 2, ,HT 3 VT 3 and HT 4 VT 4 ;

said programmable interconnect elements at said bottom input conductors and said horizontal conductors, wherein for each set of horizontal conductors 0-11, the programmable elements are provided at EBI 0 HT 0 0 , EBI 1 HT 0 1 , EBI 2 HT 2, , EBI 3 HT 3 and EBI 4 HT 4 ; and

said programmable interconnect elements at said upper input conductors and said horizontal conductors, wherein for each set of horizontal conductors 0-11, the programmable interconnect elements are provided at EUI 0 HT 0 0 , EUI 1 HT 0 1 , EUI 2 HT 2, , EUI 3 HT 3 and EUI 4 HT 4 .

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →