IP Library Granted Patent US 7,183,022
Granted Patent B2
US 7,183,022 · App. 10/439,193 · Granted Feb 27, 2007

Method for producing a mask set for lithography including at least one mask and methods for imaging structures of a predetermined layout into a common exposure plane

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Quick Facts
Patent No.
US 7,183,022
App. No.
10/439,193
Granted
Feb 27, 2007
Kind
B2
Abstract

A method for producing a mask set for lithography including at least one mask, has a predetermined layout of structures which are provided for imaging into a common exposure plane and which are transferred to the masks as a basis. Strongly coupled structures that are so closely adjacent one another, at least in sections, that they are strongly coupled in the case of simultaneous imaging are distributed between at least two different masks of the mask set.

Claims (64)

1. A method for producing a mask set for lithography including a mask, which comprises:

using, as a basis, a predetermined layout of structures to be imaged into a common exposure plane and transferred to the mask; and

transferring the structures depending on a coupling of the structures such that the structures are not strongly coupled on the mask; and

assigning auxiliary structures to individual ones of the structures for improving imageability of the structures, the assigned auxiliary structures not being imageable with radiation provided for imaging the masks, and having a specific distance d from the structure respectively assigned to the auxiliary structures and a specific width b;

determining distances D between adjacent structures;

classifying the distances D in a manner depending on coupling strength of the adjacent structures:

strong coupling being present if D<2d+b, and

at least one of weak or no coupling being present if D≧2d×b; and

dividing the structures between the masks to configure only weakly coupled structures and uncoupled structures on any one of the masks.

2. The method according to claim 1 , which further comprises:

including a further mask in the mask set for imaging into the common exposure plane; and

distributing any strongly coupled structures, being so closely adjacent one another, at least in sections, to be strongly coupled if simultaneously imaged, between the mask and the further mask of the mask set.

3. The method according to claim 1 , which further comprises:

in the classifying step, identifying structures exhibiting weak and no coupling,

weak coupling being present if

2 d+b≦D≦ 2( d+b ), and

no coupling being present if

D> 2( d+b ); and

applying, when two adjacent structures are weakly coupled on one of the individual masks, an auxiliary structure between the weakly coupled structures.

4. The method according to claim 3 , which further comprises assigning a dedicated auxiliary structure to each structure of the adjacent non-coupled structures on the respective mask.

5. The method according to claim 1 , which further comprises, for each strongly coupled structure, generating additional auxiliary structures and disposing the additional auxiliary structures on individual masks to provide, after the strongly coupled structures have been divided between the individual masks of the mask set, a symmetrical configuration of the auxiliary structures to be present with regard to the strongly coupled structures on the masks.

6. The method according to claim 1 , which further comprises forming the structures and the auxiliary structures on the masks by phase-shifting regions of the structures transparent to a radiation for imaging the masks by 180° relative to the auxiliary structures respectively assigned thereto.

7. The method according to claim 1 , which further comprises forming the structures from patterns of closely adjacent contact holes.

8. A method for imaging structures of a predetermined layout into a common exposure plane, which comprises:

providing a mask set including a phase mask, the mask being imageable by a given radiation;

applying structures onto the mask, the structures all having a given phase and being one of coupled and not coupled to one another;

applying auxiliary structures assigned to the structures onto the mask, the auxiliary structures not being imageable by the given radiation, improving an imageability of the structures assigned thereto and having a phase opposite the given phase of the structures;

the auxiliary structures having a specific width b and a specific distance d from the structure respectively assigned thereto; and

the structures disposed on each mask having a distance D≧2d+b with respect to one another.

9. The method according to claim 8 , which further comprises:

labeling adjacent structures as weakly coupled if

2 d+b≦D≦ 2( d+b )and

labeling adjacent structures as not coupled if

D> 2( d+b ); and

applying only one of the auxiliary structures between the adjacent weakly coupled structures on a given one of the masks.

10. The method according to claim 8 , which further comprises assigning dedicated auxiliary structures to adjacent non-coupled structures on a given one of the masks.

11. The method according to claim 8 , which further comprises forming the structures from patterns of closely adjacent contact holes.

12. The method according to claim 8 , which further comprises:

providing a further mask in the mask set; and

imaging the mask and the further mask successively into the common exposure plane.

13. The method according to claim 8 , which further comprises using a layer sensitive to the given radiation as the common exposure plane.

14. The method according to claim 8 , which further comprises:

providing a further mask in the mask set; and

applying the structures with a distance with respect to one another less than 2d+b by using the mask and the further mask of the mask set in the common exposure plane.

15. The method according to claim 14 , wherein the distance between the structures is less than d+b/2.

16. A method for imaging structures of a predetermined layout into a common exposure plane, which comprises:

providing a mask set including at least two masks;

applying structures onto the masks, the structures on any given one of the masks being one of weakly coupled and not coupled to one another;

applying auxiliary structures on the masks and assigning the auxiliary structures to one of the structures, the auxiliary structures not being imageable by a radiation used for imaging the masks and improving an imageability of the structures assigned thereto, the auxiliary structures further having a specific width b and a specific distance d from the structure respectively assigned thereto, and

spacing the structures on each of the masks at a distance D≧2d+b with respect to one another.

17. The method according to claim 16 , which further comprises:

labeling adjacent structures as weakly coupled if

2 d+b≦D≦ 2( d+b );

labeling adjacent structures as not coupled if D>2(d+b); and

applying one of the auxiliary structures between the adjacent weakly coupled structures disposed on each of the masks.

18. The method according to claim 16 , which further comprises assigning dedicated auxiliary structures to adjacent non-coupled structures on a given one of the masks.

19. The method according to claim 16 , which further comprises forming the structures from patterns of closely adjacent contact holes.

20. The method according to claim 16 , which further comprises imaging the two masks successively into the common exposure plane.

21. The method according to claim 16 , which further comprises using a layer sensitive to the given radiation as the common exposure plane.

22. The method according to claim 16 , which further comprises producing structures having a distance with respect to one another less than 2d+b using the two masks of the mask set in the common exposure plane.

23. The method according to claim 22 , wherein the distance between the structures is less than d+b/2.

24. The method according to claim 16 , wherein:

the masks are phase masks; and

on each of the individual masks, all of the structures have a given phase and all of the auxiliary structures have a phase opposite the given phase.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036808/0284 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023773/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2006
From: MOUKARA, MOLELA; PUFALL, REINHARD
To: INFINEON TECHNOLOGIES AG
Reel/Frame 018525/0550 →