IP Library Granted Patent US 6,838,903
Granted Patent B1
US 6,838,903 · App. 10/608,454 · Granted Jan 4, 2005

Block connector splitting in logic block of a field programmable gate array

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Quick Facts
Patent No.
US 6,838,903
App. No.
10/608,454
Granted
Jan 4, 2005
Kind
B1
Abstract

A logic block in a field programmable gate array comprises a plurality of clusters of logic devices. At least one of the logic devices in each of the clusters has an input or an output. A first set of interconnect conductors enters the logic block from a first side and forming a programmable intersection with the input or the output of at least one of the logic devices in each of the clusters. A second set of interconnect conductors enters the logic block from a second side and forming a programmable intersection with the input or output of one of the logic devices in each cluster, the first set of interconnect conductors forming a pairwise hardwired connection with the second set of interconnect conductors. An interconnect conductor splitting extension is disposed between the first set of interconnect conductors and the second set of interconnect conductors.

Claims (14)

1. Circuitry in a field programmable gate array wherein said field programmable gate array includes a logic block having a plurality of clusters wherein each of said plurality of clusters includes a plurality of logic devices wherein at least one of said plurality of logic devices has an input and an output, said circuitry comprising:

a first set of plurality of interconnect conductors entering said logic block from a first side and forming a programmable intersection with said input and said output of said at least one of said plurality of logic devices in each of said plurality of clusters;

a second set of plurality of interconnect conductors entering said logic block from a second direction and forming a first intersection with a set of at least one interconnect conductor of said first set of said plurality of interconnect conductors and forming a second intersection with a second set of a second at least one interconnect conductor of said first set of said plurality of interconnect conductors; and

an interconnect conductor splitting extension disposed between said first intersection and said second intersection formed by said second set of said plurality of interconnect conductors.

2. The circuitry of claim 1 wherein said interconnect conductor splitting extension forms a direct coupling between said first intersection and said second intersection formed by said second set of said plurality of interconnect conductors.

3. The circuitry of claim 1 wherein said interconnect conductor splitting extension further comprises:

a plurality of programmable elements.

4. The circuitry of claim 3 wherein said plurality of programmable elements comprise:

passgates controlled by a plurality static random access memory bits.

5. The circuitry of claim 3 wherein said plurality of programmable elements comprise:

anti-fuses.

6. The circuitry of claim 3 wherein each of said plurality of programmable elements comprises:

a transistor.

7. The circuitry of claim 2 wherein each of said plurality of clusters can be coupled to every other of said plurality of clusters through said interconnect conductor splitting extension.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →