Stacked semiconductor packages and method for the fabrication thereof
View Patent ↗A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.
1. A method for fabricating a stacked semiconductor package, comprising steps of:
providing a substrate;
mounting a first semiconductor device on the substrate;
supporting an interposer above the first semiconductor device opposite the substrate;
electrically connecting the interposer to the substrate wherein the step of supporting the interposer further comprises supporting the interposer on a metallic stiffener having a plurality of legs contacting the substrate and supporting the metallic stiffener on the substrate; and
mounting a second semiconductor device on the interposer.
2. The method of claim 1 further comprising partial mold encapsulating at least the first semiconductor device and at least a portion of the interposer to form an open cavity over the interposer.
3. The method of claim 1 further comprising forming at least one opening through the metallic stiffener for attaching at least one semiconductor device therethrough.
4. The method of claim 1 further comprising enhancing the stiffness of the metallic stiffener by connecting at least one pair of the legs with at least one base supporting member.
5. A method for fabricating a stacked semiconductor package, comprising steps of:
providing a substrate;
mounting a first semiconductor device on the substrate;
supporting an interposer on a metallic stiffener above the first semiconductor device opposite the substrate wherein the step of supporting the interposer further comprises supporting the interposer on a plane on the metallic stiffener, the metallic stiffener having a plurality of legs contacting the substrate and supporting the metallic stiffener on the substrate;
electrically connecting the interposer to the substrate;
partial mold encapsulating at least the first semiconductor device and at least a portion of the interposer to form an open cavity over the interposer;
mounting a second semiconductor device on the interposer within the cavity; and
encapsulating the cavity with a top encapsulant.
6. The method of claim 5 further comprising forming at least one opening through the plane for attaching at least one semiconductor device therethrough.
7. The method of claim 5 further comprising enhancing the stiffness of the metallic stiffener by connecting at least one pair of the legs opposite the plane with at least one base supporting member.
8. The method of claim 5 further comprising selecting the first and second semiconductor devices from at least one of a die, a flip chip die, a surface mountable passive, a multi-chip package, a fully assembled semiconductor package, a leadframe-based fully assembled semiconductor package, an array-based fully assembled semiconductor package, a system-in-a-package, and a combination thereof.