IP Library Granted Patent US 6,852,586
Granted Patent B1
US 6,852,586 · App. 10/677,042 · Granted Feb 8, 2005

Self assembly of conducting polymer for formation of polymer memory cell

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,852,586
App. No.
10/677,042
Granted
Feb 8, 2005
Kind
B1
Abstract

The present invention provides a selectively conductive organic semiconductor (e.g., polymer) device that can be utilized as a memory cell. A polymer solution including a conducting polymer self assembles relative to a conductive electrode. The process affords self-assembly such that a shortest conductive path can be achieved. The method includes depositing a concentrated solution of conducting polymer on a conductive surface, applying heat and optionally a vacuum, and permitting the conducting polymer to self-assemble into an organic semiconductor. The organic semiconductor can be employed within single and multi-cell memory devices by forming a structure with two or more electrodes while employing the organic semiconductor along with a passive device between the electrodes. A partitioning component can be integrated with the memory device to facilitate programming and stacking of additional memory cells on top of or in association with previously formed cells.

Claims (12)

1. A method of processing an organic memory device, comprising:

forming a channel in a semiconductor substrate material;

forming an electrode in the channel;

mixing a polymer solution comprising a conductive polymer and an organic solvent, the polymer comprising a polar group at one end and a non-polar, conjugated chain, and

depositing the polymer solution into the channel to form an organic semiconductor layer over the electrode, the polymer orienting itself so that the polar group is proximate the electrode and the non-polar chain extending away from the electrode.

2. The method of claim 1 , further comprising mixing the polymer solution with a conductive polymer concentration to facilitate spinning the solution into the channel.

3. The method of claim 2 , further comprising heating the polymer solution to increase the conductive polymer present in the polymer solution to a suitable concentration to facilitate self-assembly of the conductive polymer on an electrode.

4. The method of claim 1 , further comprising placing the polymer solution in a vacuum to facilitate removal of the organic solvent.

5. The method of claim 1 , the organic semiconductor material comprising at least one from the group consisting of polyacetylene, polyphenylacetylene, polydiphenylacetylene, polyaniline, poly(p-phenylene vinylene), polyihiophene, polyporphyrins, porphyrinic macrocycles, thiol derivatized polyporphyrins, polymetallocenes, polyferrocenes, polyphthalocyanines, polyvinylenes and polypyrroles.

6. The method of claim 1 , wherein the electrode is formed in accordance with a damascene process.

7. The method of claim 1 , wherein the electrode is formed in accordance with at least one of a single damascene process and a dual damascene process.

8. The method of claim 1 , wherein the electrode comprises copper.

Assignments (10)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MONTEREY RESEARCH, LLC
Reel/Frame 040911/0238 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS Recorded Aug 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 039708/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036036/0001 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019069/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019047/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2003
From: BUYNOSKI, MATTHEW S.; PANGRLE, SUZETTE K.; OKOROANYANWU, UZODINMA; TRIPSAS, NICHOLAS H.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 014578/0044 →