Granted Patent B1

US 7,445,507 · App. 10/741,915 · Granted Nov 4, 2008

Abstract

Claims (51)

1. A connector module, comprising:

a jack socket capable of receiving a communication link;

magnetics coupled to the jack socket, the magnetics capable of facilitating at least one of communication of information to a peripheral device coupled to the link and reception of information from the peripheral device; and wherein the magnetics comprise,

a transformer including a first coil having a center tap and a second coil having a center tap, and

a coil filter coupled in series with the first transformer, the coil filter including a first filter coil, a second filter coil and a third filter coil, wherein a first terminal of the second filter coil is coupled to the center tap of the first coil of the transformer; and

physical layer logic coupled to the magnetics and capable of supporting a physical layer protocol used to at least one of communicate the information to and receive the information from the peripheral device.

2. The connector module of claim 1 , wherein the physical layer logic comprises an integrated circuit chip.

3. The connector module of claim 1 , further comprising Power-over-Ethernet management logic capable of being coupled to the magnetics, the magnetics capable of supplying power to the peripheral device through the jack socket, the Power-over-Ethernet management logic capable of controlling the supplying of power to the peripheral device.

4. The connector module of claim 1 , further comprising:

a light emitting diode capable of providing of at least one visual indicator associated with at least one condition associated with the link; and

light emitting diode control logic capable of driving the light emitting diode into at least one state to provide the at least one visual indicator.

5. The connector module of claim 1 , wherein the connector module comprises a plurality of jack sockets.

6. The connector module of claim 1 , wherein the jack sockets comprise at least one of RJ-45 jack sockets and RJ-21 jack sockets.

7. The connector module of claim 1 , wherein the physical layer logic is one of: permanently embedded within a shielding of the connector module and removable from the connector module.

8. The connector module of claim 1 , wherein the physical layer logic is coupled to a motherboard.

9. The connector module of claim 8 , wherein the physical layer logic is coupled to the motherboard by two connections, the two connections associated with the jack socket and supporting differential signaling between the physical layer logic and a processor on the motherboard.

10. A motherboard, comprising:

a processor capable of communicating with at least one peripheral device; and

a connector module comprising:

a jack socket capable of receiving a communication link;

magnetics coupled to the jack socket, the magnetics capable of facilitating at least one of communication of information to the peripheral device coupled to the link and reception of information from the peripheral device, and wherein the magnetics comprise,

a transformer including a first coil having a center tap and a second coil having a center tap, and

a coil filter coupled in series with the first transformer, the coil filter including a first filter coil, a second filter coil and a third filter coil, wherein a first terminal of the second filter coil is coupled to the center tap of the first coil of the transformer; and

physical layer logic coupled to the magnetics and capable of supporting a physical layer protocol used to at least one of communicate the information to and receive the information from the peripheral device.

11. The motherboard of claim 10 , wherein the physical layer logic is coupled to the processor by two connections, the two connections associated with the jack socket and supporting differential signaling between the physical layer logic and the processor.

12. The motherboard of claim 10 , wherein the physical layer logic comprises an integrated circuit chip.

13. The motherboard of claim 10 , further comprising Power-over-Ethernet management logic capable of being coupled to the magnetics, the magnetics capable of supplying power to the peripheral device through the jack socket, the Power-over-Ethernet management logic capable of controlling the supplying of power to the peripheral device.

14. The motherboard of claim 10 , wherein the connector module further comprises:

a light emitting diode capable of providing of at least one visual indicator associated with at least one condition associated with the link; and

light emitting diode control logic capable of driving the light emitting diode into at least one state to provide the at least one visual indicator.

15. The motherboard of claim 10 , wherein the physical layer logic is one of: permanently embedded within a shielding of the connector module and removable from the connector module.

16. The motherboard of claim 10 , wherein the connector module comprises a plurality of jack sockets.

17. The motherboard of claim 16 , wherein the jack sockets comprise at least one of RJ-45 jack sockets and RJ-21 jack sockets.

18. A method, comprising:

providing a physical layer integrated circuit chip capable of supporting a physical layer protocol, the physical layer protocol used to facilitate at least one of communication of information to a peripheral device coupled to a communication link and reception of information from the peripheral device;

coupling the physical layer chip to magnetics, the magnetics coupled to a jack socket and capable of bridging the physical layer chip and the jack socket, and wherein the magnetics comprise,

a transformer including a first coil having a center tap and a second coil having a center tap, and

a coil filter coupled in series with the first transformer, the coil filter including a first filter coil, a second filter coil and a third filter coil, wherein a first terminal of the second filter coil is coupled to the center tap of the first coil of the transformer; and

shielding the physical layer chip and the magnetics to form a connector module.

19. The method of claim 18 , further comprising coupling the physical layer chip to a light emitting diode capable of providing of at least one visual indicator associated with at least one condition associated with the link;

wherein the physical layer chip comprises light emitting diode control logic capable of driving the light emitting diode into at least one state to provide the at least one visual indicator.

20. The method of claim 18 , further comprising coupling the connector module to a motherboard.

21. An apparatus, comprising:

a motherboard comprising a processor;

a connector module coupled to the motherboard and comprising:

a plurality of jack sockets capable of receiving a plurality of communication links;

a plurality of magnetics coupled to the jack sockets, the plurality of magnetics capable of supplying power to a plurality of peripheral devices coupled to the links through the jack sockets, and wherein the each of the magnetics comprise,

a transformer including a first coil having a center tap and a second coil having a center tap, and

a coil filter coupled in series with the first transformer, the coil filter including a first filter coil, a second filter coil and a third filter coil, wherein a first terminal of the second filter coil is coupled to the center tap of the first coil of the transformer; and

physical layer logic coupled to the plurality of magnetics and capable of supporting a physical layer protocol used to at least one of communicate the information to and receive the information from the peripheral devices; and

a power supply capable of supplying power to at least one of the motherboard and the connector module.

Assignments (23)