IP Library › Granted Patent US 6,925,704
Granted Patent B1
US 6,925,704 · App. 10/744,846 · Granted Aug 9, 2005

Method for making high power resistor having improved operating temperature range

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Quick Facts
Patent No.
US 6,925,704
App. No.
10/744,846
Granted
Aug 9, 2005
Kind
B1
Abstract

A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of −65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.

Claims (25)

1. A method for making a high power resistor comprising:

forming a resistor blank comprising a resistance element, a first lead, and a second lead; the resistance element having first and second opposite ends, first and second opposite side edges, a first flat surface, and a second flat surface opposite from the first flat surface; the first and second leads extending from the first and second opposite ends of the resistance element;

making a pre-mold body having first and second slots fitted around the first and second opposite side edges of the resistance element and having a bottom portion engaging the first flat surface of the resistance element;

depositing an electrically non conductive and heat conductive adhesive on the second flat surface of the resistance element, the adhesive having the properties of maintaining the structural integrity and adhesive capabilities of the adhesive in the temperature range of −65° C. to +275° C.;

placing a heat sink in contact with the adhesive with the adhesive between the heat sink and the second flat surface of the resistance element whereby the adhesive will attach the heat sink to the second flat surface of the resistance element and will conduct heat from the resistance element to the heat sink;

molding a molded body completely around the pre-molded body, the resistance element, and the adhesive, and partially around the heat sink;

exposing a portion of the heat sink to the atmosphere through the molded body;

whereby the heat conducting relationship of the resistance element, the adhesive and the heat sink render the resistance element capable of operating as a resistor between temperatures of from −65° C. to +275° C.

2. The method of claim 1 and farther comprising welding the first and second leads to the first and second ends of the resistance element.

3. The method of claim 1 wherein the molded body includes first and second ends and a bottom surface, the method further comprising extending the first and second leads outside the first and second ends of the molded body and bending the first and second leads into facing relation with the bottom surface of the molded body.

4. A method for making a high power resistor comprising:

forming a resistor blank comprising a non-e lm resistance element, a first lead, and a second lead, the resistance element having first and second opposite ends, first and second opposite side edges, a first flat surface, and a second flat surface opposite from the first flat surface, the first and second leads extending from the first and second opposite ends of the resistance element;

depositing an electrically non conductive and heat conductive adhesive on the second flat surface of the resistance element, the adhesive having the properties of maintaining the structural integrity and adhesive capabilities of the adhesive in the temperature range of −65° C. to +275° C.;

placing a heat sink in contact with the adhesive with the adhesive between the heat sink and the second flat surface of the resistance element whereby the adhesive will attach the heat sink to the second flat surface of the resistance element and will conduct heat from the resistance element to the heat sink;

molding a molded body completely around the resistance element and the adhesive, and partially around the heat sink;

exposing a portion of the heat sink to the atmosphere through the molded body;

whereby the heat conducting relationship of the resistance element, the adhesive and the heat sink render the resistance element capable of operating as a resistor between temperatures of from −65° C. to +275° C.

5. A method for making a high power resistor comprising:

making a resistor blank comprising a non-film resistance element having a power rating of less than 6 watts, a first lead, and a second lead, the resistance element having first and second opposite ends, first and second opposite side edges, a first flat surface, and a second flat surface opposite from the first flat surface, the first and second leads extending from the first and second opposite ends of the resistance element;

depositing an electrically non conductive and heat conductive adhesive on the second flat surface of the resistance element, the adhesive having the properties of maintaining the structural integrity and adhesive capabilities of the adhesive in the temperature range of −65° C. to +275° C.;

placing a heat sink in contact with the adhesive with the adhesive between the heat sink and the second flat surface of the resistance element whereby the adhesive will attach the heat sink to the second flat surface of the resistance element and will conduct heat from the resistance element to the heat sink;

molding a molded body completely around the resistance element and the adhesive, and partially around the heat sink;

exposing a portion of the heat sink to the atmosphere through the molded body;

whereby the heat conducting relationship of the resistance element, the adhesive and the heat sink cause the resistance element to function at 100% of the rated wattage between the temperatures of −65° C. and +70° C.

6. The method according to claim 5 and further comprising forming a pre-mold body having first and second slots that embrace the first and second opposite edges of the resistance element, toe molding of the molded body being completely around the pre-mold body.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →