High voltage ESD-protection structure
View Patent ↗A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g., transistor, having high current conduction capabilities, in the ESD-protection structure that may be controlled (triggered) by the device (e.g., diode) determining the controlled breakdown voltage (at which the ESD voltage is clamped to a desired value). The high voltage ESD-protection structure may be located substantially under the bond pad and may also include a low capacitance forward diode structure between the bond pad and the ESD clamp circuit.
1. An ESD-protection structure, comprising:
an integrated circuit having a lighter doped p-silicon well (P-well);
a first lighter doped n-silicon well (first N-well) in the P-well;
a plurality of first heavier doped p-silicon diffusions (first P+ diffusions) in the first N-well;
a first heavier doped n-silicon diffusion (first N+ diffusion) in the first N-well, wherein the first N+ diffusion surrounds the plurality of first P+ diffusions;
a second lighter doped n-silicon well (second N-well) in the P-well, the second N-well adjacent to the first N-well;
a second heavier doped n-silicon diffusion (second N+ diffusion) in the second N-well, the second N+ diffusion is connected to the first N+ diffusion;
a second heavier doped p-silicon diffusion (second P+ diffusion) in the second N-well;
a third heavier doped p-silicon diffusion (third P+ diffusion) in the P-well, the third P+ diffusion is connected to the second P+ diffusion, wherein the third P+ diffusion surrounds the first N+ diffusion, the plurality of first P+ diffusions, the second N+ diffusion and the second P+ diffusion;
a bond pad connected to the plurality of first P+ diffusions.
2. The ESD-protection structure of claim 1 , wherein the P-well is the integrated circuit substrate.
3. The ESD-protection structure of claim 1 , further comprising a lighter doped n-silicon substrate (N-substrate) of the integrated circuit, wherein the P-well is in the N-substrate.
4. The ESD-protection structure of claim 1 , wherein the plurality of first P+ diffusions are rectangular shaped.
5. The ESD-protection structure of claim 1 , wherein the plurality of P+ diffusions are square shaped.
6. The ESD-protection structure of claim 1 , wherein the plurality of P+ diffusions are stripe shaped.
7. The ESD-protection structure of claim 1 , wherein the bond pad is connected to the plurality of first P+ diffusions with a first plurality of conductive vias.
8. The ESD-protection structure of claim 1 , wherein the connection between the first and second N+ diffusions is with a second plurality of conductive vias.
9. The ESD-protection structure of claim 1 , wherein the connection between the second and third P+ diffusions is with a third plurality of conductive vias.
10. The ESD-protection structure of claim 7 , wherein the first plurality of conductive vias are metal.
11. The ESD-protection structure of claim 7 , wherein the first plurality of conductive vias comprise conductive semiconductor silicon.
12. The ESD-protection structure of claim 8 , wherein the second plurality of conductive vias are metal.
13. The ESD-protection structure of claim 8 , wherein the second plurality of conductive vias comprise conductive silicon.
14. The ESD-protection structure of claim 9 , wherein the third plurality of conductive vias are metal.
15. The ESD-protection structure of claim 9 , wherein the third plurality of conductive vias comprise conductive silicon.
16. The ESD-protection structure of claim 1 , further comprising a second connection to the first N+ diffusion with a fourth plurality of conductive vias.
17. The ESD-protection structure of claim 1 , wherein the P-well is coupled to ground.
18. The ESD-protection structure of claim 1 , wherein the P-well is coupled to a common power supply rail.
19. The ESD-protection structure of claim 1 , wherein the third P+ diffusion is coupled to ground.
20. The ESD-protection structure of claim 1 , wherein the third P+ diffusion is coupled to a common power supply rail.
21. The ESD-protection structure of claim 1 , wherein the plurality of first P+ diffusions are located substantially under the bond pad.
22. A system for protecting an integrated circuit from ESD damage, said system comprising:
an ESD-protection structure for at least one of a plurality of input and output connections of an integrated circuit, wherein the ESD-protection structure comprises:
an integrated circuit having a lighter doped p-silicon well (P-well);
a first lighter doped n-silicon well (first N-well) in the P-well;
a plurality of first heavier doped p-silicon diffusions (first P+ diffusions) in the first N-well;
a first heavier doped n-silicon diffusion (first N+ diffusion) in the first N-well, wherein the first N+ diffusion surrounds the plurality of first P+ diffusions;
a second lighter doped n-silicon well (second N-well) in the P-well, the second N-well adjacent to the first N-well;
a second heavier doped n-silicon diffusion (second N+ diffusion) in the second N-well, the second N+ diffusion is connected to the first N+ diffusion;
a second heavier doped p-silicon well (second P+ diffusion) in the second N-well;
a third heavier doped p-silicon diffusion (third P+ diffusion) in the P-well, the third P+ diffusion is connected to the second P+ diffusion, wherein the third P+ diffusion surrounds the first N+ diffusion, the plurality of first P+ diffusions, the second N+ diffusion and the second P+ diffusion;
a bond pad connected to the plurality of first P+ diffusions.