IP Library Granted Patent US 7,151,229
Granted Patent B2
US 7,151,229 · App. 10/814,041 · Granted Dec 19, 2006

Printed circuit board with improved cooling of electrical component

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Quick Facts
Patent No.
US 7,151,229
App. No.
10/814,041
Granted
Dec 19, 2006
Kind
B2
Abstract

The present invention relates to improved cooling of an electronic component loaded to a Printed Circuit Board, wherein the PCB comprises at its upper side at least one electronic component, and at least one Heat Conducting Member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the lower side of the PCB and has a thermal contact to the component.

Claims (13)

1. A printed circuit board (PCB) having a through-hole between an upper side and a lower side of the PCB, comprising:

at least one electronic component attached to the upper side,

at least one heat-conducting member (HCM) for inserting into the through-hole, extending from the upper side to the lower side, and being thermally coupled with said electronic component, and

the HCM comprising a substantially planar, disc-shaped top portion and tapered or recessed, ring-shaped bottom portion, wherein said top portion is thermally coupled with said electronic component and wherein said top portion comprises several projections radially extending from an outer edge of the top portion, said projections affixed the HCM to the PCB by penetrating into an inner wall enclosing the through-hole, and wherein the bottom portion has a final shape resulting from plastically deforming an origin shape of the bottom portion by pressing the HCM substantially perpendicular to the top portion via a planar pressing tools.

2. The PCB according to claim 1 , wherein:

the through-hole is arranged substantially centrally underneath the component, and

a top side of the HCM is directly thermally coupled with a bottom side of the component.

3. The PCB according to claim 1 , wherein between the bottom portion and an inner wall enclosing the through-hole a ring shaped gap is provided.

4. The PCB according to claim 1 , wherein said PCB comprises at least one feature from the group consisting of:

a top side of the HCM is disposed on the same plane as said upper side of the PCB, and

a bottom side of the HCM is disposed on the same plane as said lower side of the PCB.

5. The PCB according to claim 1 , wherein the HCM has a substantially rotationally symmetrical shape.

6. The PCB according to claim 1 , wherein the HCM is thermally contacted with at least one of a heat sink and a cooling device preferably attached to the lower side of the PCB.

Assignments (6)
CHANGE OF ADDRESS Recorded Dec 18, 2018
From: ADVANTEST CORPORATION
To: ADVANTEST CORPORATION
Reel/Frame 047987/0626 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 035371 FRAME: 0265. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 14, 2015
From: ADVANTEST (SINGAPORE) PTE. LTD.
To: ADVANTEST CORPORATION
Reel/Frame 035425/0768 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 6, 2015
From: ADVANTEST (SINGAPORE) PTE. LTD.
To: ADVANTEST CORPORATION
Reel/Frame 035371/0265 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2012
From: VERIGY (SINGAPORE) PTE LTD
To: ADVANTEST (SINGAPORE) PTE LTD
Reel/Frame 027896/0018 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2007
From: AGILENT TECHNOLOGIES, INC.
To: VERIGY (SINGAPORE) PTE. LTD.
Reel/Frame 019015/0119 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2004
From: AGILENT TECHNOLOGIES DEUTSCHLAND, GMBH
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 015550/0069 →