Heat spreader for thermally enhanced semiconductor package
View Patent ↗An electronic device having a substrate carrier is provided. A semiconductor connected to the substrate carrier. A heat spreader having upper and lower surfaces and legs recessed below the lower surface is connected to the substrate carrier. The Z-dimension between the heat spreader and the substrate carrier is maintained over substantially the entire area of the substrate carrier.
1. An electronic device comprising:
a substrate carrier;
a semiconductor connected to the substrate carrier;
a heat spreader having a body portion with a perimeter, a lower surface, and a number of legs formed from the body portion of the heat spreader, interior to the perimeter of the body portion, recessed below the body portion, and attached to the substrate carrier, wherein:
the distance between the substrate carrier and the lower surface of the body portion of the heat spreader defines a Z-dimension; and
the Z-dimension is maintained constant over substantially the entire surface area of the body portion of the heat spreader except proximate the legs.
2. The electronic device as claimed in claim 1 wherein the number of legs comprises a leg base of at least one of circular, solid circular, square, rectangular, split, the edge of the leg, and combinations thereof.
3. The electronic device as claimed in claim 1 wherein the legs are located interior of the perimeter of the heat spreader in a position of at least one of the corners, intermediate the corners, and combinations thereof.
4. The electronic device as claimed in claim 1 further comprising at least one passive component attached to the substrate carrier.
5. The electronic device as claimed in claim 1 wherein the legs of the heat spreader are attached to the substrate carrier using a thermally conductive adhesive.
6. The electronic device as claimed in claim 1 wherein the heat spreader is attached to the semiconductor using a thermally conductive adhesive.
7. The electronic device as claimed in claim 1 , further comprising a number of solder balls attached to the substrate carrier.
8. The electronic device as claimed in claim 1 wherein:
the semiconductor is encapsulated with an encapsulant; and
the heat spreader is partially at least one of exposed through the encapsulant, embedded in the encapsulant, and combinations thereof.
9. The electronic device as claimed in claim 8 , further comprising a number of circular spaces in the heat spreader, forming ejector pin areas.
10. An electronic device comprising:
a substrate carrier having upper and lower surfaces;
a semiconductor attached to the upper surface of the substrate carrier with a thermally conductive adhesive;
a heat spreader having a body portion with a perimeter, a lower surface, and a number of legs formed from the body portion of the heat spreader, interior to the perimeter of the body portion of the heat spreader, recessed below the body portion of the heat spreader, and attached to the substrate carrier with a thermally conductive adhesive;
the body potion of the heat spreader extending over substantially the entire upper surface of the substrate carrier except proximate the legs; and
a number of solder balls attached to the lower surface of the substrate carrier.
11. The electronic device as claimed in claim 10 wherein:
the distance between the substrate carrier and the lower surface of the body portion of the heat spreader defines a Z-dimension; and
the Z-dimension is maintained constant over substantially the entire surface area of the substrate carrier except proximate the legs.
12. The electronic device as claimed in claim 10 wherein the number of legs comprises a leg base of at least one of circular, solid circular, square, rectangular, split, the edge of the leg, and combinations thereof.
13. The electronic device as claimed in claim 10 wherein the legs are located interior of the perimeter of the heat spreader in a position of at least one of the corners, intermediate the corners, and combinations thereof.
14. The electronic device as claimed in claim 10 further comprising at least one passive component attached to the substrate carrier.
15. The electronic device as claimed in claim 10 wherein:
the semiconductor is encapsulated with an encapsulant; and
the heat spreader is partially at least one of exposed through the encapsulant, embedded in the encapsulant, and combinations thereof.
16. The electronic device as claimed in claim 15 , further comprising ejector pin areas in the heat spreader.
17. A heat spreader comprising:
a body portion having a perimeter and a lower surface;
a number of legs formed from the body portion, interior to the perimeter of the body portion, and recessed below lower surface of the body portion;
each of the legs comprising a leg base having a lower surface; and
wherein the distance between the lower surface of the body portion and the lower surface of each leg base defines a Z-dimension.
18. The heat spreader as claimed in claim 17 wherein the number of legs comprises a leg base of at least one of circular, solid circular, square, rectangular, split, the edge of the leg, and combinations thereof.
19. The heat spreader as claimed in claim 17 wherein the number of legs are located interior of the perimeter of the heat spreader in a position of at least one of the corners, intermediate the corners, and combinations thereof.