IP Library Granted Patent US 7,034,569
Granted Patent B1
US 7,034,569 · App. 10/850,054 · Granted Apr 25, 2006

Programmable system on a chip for power-supply voltage and current monitoring and control

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Quick Facts
Patent No.
US 7,034,569
App. No.
10/850,054
Granted
Apr 25, 2006
Kind
B1
Abstract

A programmable system-on-a-chip integrated circuit device includes a programmable logic block, at least one user non-volatile memory block, and voltage-measuring and control analog and digital circuits on a single semiconductor integrated circuit chip or a flip chip, face-to-face, or other multiple die configuration. The programmable system-on-a-chip integrated circuit with voltage-measuring, current-measuring and control circuitry performs voltage measurement and control functions and can be used to control and monitor external power supplies connected to external loads.

Claims (23)

1. A programmable system-on-a-chip integrated circuit device comprising:

a programmable logic block;

a digital input/output circuit block;

a non-volatile memory block;

an analog circuit block including an analog-to-digital converter;

an analog input/output circuit block including, at least one voltage-measuring circuit coupled to a first I/O pad, and at least one programmable MOSFET gate-drive circuit coupled to a second I/O pad; and

a programmable interconnect architecture including programmable elements and interconnect conductors, ones of said programmable elements coupled to said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, said digital input/output circuit block, and to said interconnect conductors, such that inputs and outputs of said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, and said digital input/output circuit block can be programmably coupled to one another.

2. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said at least one voltage-measuring circuit includes a programmable voltage prescaling circuit.

3. The programmable system-on-a-chip integrated circuit device of claim 1 further including at least one current-measuring circuit coupled to said first I/O pad and a third I/O pad.

4. The programmable system-on-a-chip integrated circuit device of claim 1 further including a bandgap reference circuit.

5. The programmable system-on-a-chip integrated circuit device of claim 1 further including a system controller block including a power-up controller configured to apply system power to said programmable logic block, said digital input/output circuit block, said non-volatile memory block, said analog circuit block, and said analog input/output circuit block in a predetermined sequence.

6. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said system controller block further includes a system supervisor block coupled to at least one of said programmable logic block, said digital input/output circuit block, said non-volatile memory block, said analog circuit block, and said analog input/output circuit block, and configured to monitor the output voltage of at least one external power supply circuit coupled to a circuit external to the programmable system-on-a-chip integrated circuit device.

7. The programmable system-on-a-chip integrated circuit device of claim 5 wherein said system supervisor block is further configured to control said at least one MOSFET gate-drive circuit in response to the output voltage of said at least one external power supply circuit.

8. The programmable system-on-a-chip integrated circuit device of claim 6 wherein:

said analog-to-digital converter has an input programmably coupled to an output of said voltage-measuring circuit;

a digital comparator in said programmable logic block has one input programmably coupled to an output of said analog-to-digital converter and another input programmably coupled to a register containing a digital voltage-threshold value; and

said system supervisor block is coupled to an output of said digital comparator and is configured to control said at least one MOSFET gate-drive circuit in response to an output state of said digital comparator.

9. The programmable system-on-a-chip integrated circuit device of claim 6 wherein said second I/O pad of said programmable system-on-a-chip integrated circuit device is coupled to a gate of an external MOSFET device having a first source/drain terminal coupled to said output voltage of said at least one external power supply circuit and a second source/drain terminal coupled to a load for said at least one external power supply circuit.

10. The programmable system-on-a-chip integrated circuit device of claim 1 , further including a user-available volatile memory block including a register and said register containing a digital voltage-threshold value is downloaded to said volatile memory register from said non-volatile memory block by said system controller block during startup of said system-on-a-chip integrated circuit device.

11. The programmable system-on-a-chip integrated circuit device of claim 3 , wherein:

an external resistor is coupled between said first and third I/O pads;

said analog-to-digital converter has an input programmably coupled to an output of said current-measuring circuit;

a digital comparator in said programmable logic block has one input programmably coupled to an output of said analog-to-digital converter and another input programmably coupled to a register containing a digital voltage-threshold value; and said system supervisor block is coupled to an output of said digital comparator and is configured to control said at least one MOSFET gate-drive circuit in response to an output state of said digital comparator.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: BALASUBRAMANIAN, RABINDRANATH; BAKKER, GREGORY
To: ACTEL CORPORATION
Reel/Frame 015461/0380 →